|Platinawerf 20-G||T: +31 24 678 2888|
|6641 TL, Beuningen (GLD)||F: +31 24 678 2899|
|The Netherlands||Email - Web|
ASM Laser Separation International is the inventor of multi-beam laser dicing and grooving. The multi laser beam dicing and grooving process is the technology with very low thermal impact while having a very high productivity. ASM Laser Separation’s solutions enable you to reduce your manufacturing cost significantly and to execute your semiconductor technology road map.
To enable the low cost of ownership all modules within the system support and contribute to achieve this proposition. To keep up with the demanding semiconductor market, continuous technology development enables; smaller, better and more cost effective products for wafer dicing and grooving applications.
We offer laser dicing and grooving systems that enable the lowest cost of ownership through the shortest process time and high flexibility. This ensures that ASMPT’s laser systems are ideally suited for your application.
We develop laser dicing and grooving solutions that enable semiconductor manufacturers to reduce the product manufacturing cost through yield improvement, higher productivity, and increased number of dies per wafer. Our expertise is in RFIC, LED, IC, Low-K and Discrete.
Machine ConceptsMay 15, 2019
The design of ALSI machine platform has been made with productive and accurate laser dicing of semiconductor wafers in mind. It incorporates over 12 years of experience in laser dicing of wafers originally at NXP (formerly Philips Semiconductor), and the extensive know-how available in the well-established semiconductor equipment manufacturers in The Netherlands and Germany. Read more
Laser separation technique: Multiple Laser Beam Technology (MLBT)March 16, 2019
The two main requirements for any separation process are a superior cutting quality – in terms of visual appearance and structural integrity of the cut – and a low throughput time. The latter depends to a great extend on the dicing speed thus the material removal rate of the process. In the case of laser dicing both requirements are generally speaking diametrical opposed to each other. The material removal rate scales with increasing laser power, the dicing quality deteriorates accordingly. Typically a fast laser separation process comes along with a wide cut, rough edges, increased volumes of recast and burr as well as a pronounced heat affected zone (HAZ). Read more and watch the video
ASMPT Receives ORCAS EP Order from a Leading Semiconductor ManufacturerOctober 11, 2016
ASMPT has recently received multiple orders from the leading semiconductor manufacturers in ASIA for their latest generation of encapsulation solution for large format packaging, ORCAS EP Dual Press.
ASMPT Ranked Among the Top 5 in VLSI Customer Satisfaction Survey 2016June 11, 2016
ASM Pacific Technology Limited (“ASMPT”) announced today that its focus on customer excellence has once again been recognised in the VLSIresearch’s annual Customer Satisfaction Survey on Chip Making Equipment. For the past few years, customers have ranked ASMPT among the top 10 BEST equipment suppliers. Read more
ASMPT Awarded the 2015 Supplier Excellence AwardApril 9, 2016
ASM Pacific Technology Limited (ASMPT) received the prestigious 2015 Supplier Excellence Award (SEA) from it customer, Texas Instruments (TI). ASMPT was recognised for its outstanding performance as a supplier of lead frames.
ASMPT Wins the 2015 Hong Kong Awards for Industries: Technological Achievement Grand AwardDecember 15, 2015
In developing a solution that is truly making a difference in semiconductor manufacturing, ASM Pacific Technology Limited (“ASMPT”), a world leader in the supply of semiconductor assembly and packaging equipment and materials as well as surface mount technology solutions, received the 2015 Technology Achievement Grand Award for its Thermo-Compression Bonding (TCB) tool.
ASMPT and SPIL announce Joint Investment Venture in Molded Interconnect SubstratesOctober 23, 2015
ASM Pacific Technology Limited (“ASMPT”) and Siliconware Precision Industries Co., Ltd. (“SPIL”)announced today that both companies will enter into an agreement to establish a joint investment entity to develop and manufacture molded interconnect substrates (“MIS”) to meet the industry’s demand for advanced semiconductor chips with greater functionality.