Zuken works globally with leading companies to optimize their electrical and electronic engineering design and related manufacturing processes through the provision of leading edge software and consulting services. Our unique combination of proven experience, technological expertise and agility creates best in class solutions. Our transparent working practices and belief in integrity in all aspects of business produces long lasting and successful customer partnerships.
Zuken introduces new solution for 3D harness design optimizationmaart 2, 2019
Zuken introduces E3.WiringSystemLab, a new software solution that enables the optimization of complex wire harness designs based on inputs from heterogeneous sources. The product can import connectivity information from a broad range of sources and consolidates them with 3D topology data. The resulting 3D topology can be evaluated and optimized in a consistent 3D environment that has been designed to support the needs of casual users without requiring specialized training. Specialized functionality tailored specifically to topology exploration provides. Read more
Tech Tip: Routing a PCB design in a native 3D Toolmaart 1, 2019
PCB design tools were built on 2D software methods in the 1980s. Many of today’s design tools still use that 2D code base. Mechanical tools have moved on to native 3D design. PCB has been stuck more or less in the 2D world. Extensions to the 2D code base made 2.5D and 3D visualization possible. But designing in 3D requires the tool to be built on a 3D kernel. Article
Zuken to Acquire Vitech Corporationfebruari 1, 2019
Westford, MA, USA – Zuken Inc (6947:TYO) today announced an agreement to purchase Vitech Corporation for an undisclosed amount. Vitech is a global solutions company based in Blacksburg, VA, United States, specializing in systems engineering, with products and services directed at the Model-Based Systems Engineering (MBSE) market. Read more
Volt Air: Why Electric Flight Will be on Fast Charge This Yearjanuari 19, 2019
For me nothing bridges the gap between the present and the future more than electric flight. I’ve spent my whole career in the electronics industry and this sector captures my imagination more than any other. These are particularly exciting times for the aerospace industry because, not only is interest in electric flight on fast charge but, with developments in AI, there’s also talk of pilotless flight. Here are some sector updates that have caught my attention in the past few months… Read more
Curved Trunking: New SI Routing Feature for Differential Pairs and Busses in CADSTARjanuari 4, 2019
PCB designers working with advanced and complex designs are constantly pushing the boundaries to satisfy the signal integrity of routed differential pairs and busses. Those who work with flexible and flex-rigid PCB designs are perhaps the most demanding of all. Read more
Zuken, CADENAS and ECAD-Port announce component library cooperationnovember 21, 2018
Zuken has signed a partnership agreement with CADENAS, a leading provider of online component libraries, and ECAD-Port, a specialized provider for electrical components library services. Read more
Zuken’s E3.series Selected for ACCEL All-Electric Flight Research Initiativeoktober 17, 2018
UK-based Electroflight has recently selected E3.series, Zuken’s electrical and fluid engineering solution. Specialists in high performance electric powertrains, Electroflight is using E3.series to design, build, test and commercialize an all-electric aircraft – all within a 24-month timeframe – as part of the Accelerating the Electrification of Flight (ACCEL) research initiative. Read more
IoT Enables Connected Designseptember 27, 2018
Using feedback from products in the field to continuously improve design modules used as the basis for product development can increase product performance and reliability and reduce development time.
OEMs have made enormous strides in feeding back information from the manufacturing process into design to increase process yields. Metrics important to customers such as performance, reliability and usability would be much more useful inputs to the design process, but traditionally they have been much more difficult to obtain. Now Internet of Things platforms can collect and analyze this information and modular design systems can present it to designers in context. Read more [source: eetimes.com]
Metal Additive Helps Overcome Tough Electronics Cooling Challengeseptember 15, 2018
Man-carried military communication systems often consume large amounts of power. The heat must be removed from the electronics package to avoid frying sensitive electronic components. The package typically is designed to be carried in a backpack which often puts difficult constraints on the form factor and weight of the system. A military system integrator approached Additive Design Consultancy with the challenge of providing a thermal management solution for a 14 by 10 by 5 inch system. Read more
Zuken and Polar Instruments Collaborate to Achieve Design Consistency from Prototype to Volume Productionaugustus 24, 2018
Zuken CR-8000 Design Force Now Connects with Polar Speedstack PCB Stackup / ECAD Interface Read more
Developing an Integrated Electronics Manufacturing Processaugustus 18, 2018
The silicon brains of today’s warfighters are just as complex as their alloy exteriors, requiring engineers like those at Lockheed Martin to have mastery of not only aeronautics and flight, but also advanced computing and electronics. Read more
Technological Advancements Transform Space into a Broader Information Enterpriseaugustus 4, 2018
The space industry is engaged in a remarkable technological transformation from primarily government-driven stand-alone projects to a private industry-driven supply chain collaborating to create exciting new services for businesses and consumers. The key technology trends that are driving the new space industry are recyclable and smaller launch vehicles that are reducing the cost of putting satellites into orbit. Another key trend is smaller satellites, weighing from less than one to a few hundred pounds, that lower the barrier to entry for new space applications. Read more
Zuken Addresses Complexity Challenge with E3.series 2018juli 24, 2018
The latest release of Zuken’s electrical and fluid engineering solution, E3.series, addresses the challenge of growing complexity within today’s products and processes. Key enhancements lie in the areas of topology planning, modularity support and variant handling, which are designed to support the requirements of manufacturing companies using modular product design to control complexity. Read further
How to Handle 300 Miles of Electrical Wiringjuli 10, 2018
Aircraft electrical design projects tend to be very large and extremely complex. The challenges associated with managing the sheer number of wires (required for avionics systems, engines, sensors, in-flight-entertainment etc.) is frequently compounded by the distances some signals must travel within the airframe, passing through several harnesses on route. For example, an Airbus A380 – with its wingspan of almost 80m and a nose-to-tail length of almost 73m – allegedly has around 480km (300 miles) of wiring. Read more
Zuken Enables 3D, Barrier-free Collaboration Between Automotive OEMs and Harness Suppliersjuni 21, 2018
Zuken’s wire harness visualization and analysis software, E3.HarnessAnalyzer, has been enhanced and extended to support the latest industry standard data formats, visualize harness data in 3D, and automatically compile schematic drawings for the displayed modules.
With these capabilities, E3.HarnessAnalyzer enables OEMs and suppliers to open, inspect and collaborate on previously proprietary harness design data generated by different authoring tools used in the industry.
Tech Tip: CR-8000 Design Force 2018 Reinforce Via Functionalityjuni 13, 2018
Tech Tip: Use ‘Generate Bump Line’ in Design Force to Match Lengths of Positive & Negative Tracksmei 31, 2018
In CR-8000 Design Force, the Generate Bump utility allows the designer to add a bump line either single or sequentially to a differential pair route. Bump line size, style and space can be set in the dialog. Accurate length differences can be seen in the Constraint Browser during this process.
Why Are Automotive Wiring Systems Experts Getting Excited about the Digital Twin?april 14, 2018
While the concept of a digital twin has been around since the early 2000s, it’s only thanks to the Internet of Things (IoT) that its time has come. It was recently named one of Gartner’s Top 10 Strategic Technology Trends for 2018.
Simply speaking, a digital twin is a virtual model of a process or product, which is paired to the physical world. This approach allows the analysis of data and creates a wide range of new technical and commercial opportunities.
Controlling the Release Points for Your PLM/PDM Systemapril 5, 2018
There is one thing that all design engineers will agree on: creating and gathering all the required data for PLM is error-prone and can be a royal pain. We all understand the value of releasing our design data to the corporate PLM system but our design process dictates multiple release points, and each one has a different purpose and data requirements.
XJTAG Announces DFT Assistant for Zuken CR-8000 PCB design suitefebruari 23, 2018
Zuken® and XJTAG®, a leader in boundary scan and design for test technology, have released a plugin that will enhance Zuken’s CR-8000 with a design for test (DFT) capability improving test coverage by allowing additional design checks during schematic entry. The capability is based on XJTAG’s DFT Assistant and will be released as a free plugin for Zuken’s CR-8000 Design Gateway users at Embedded World 2018 in Nuremberg, Germany.
Zuken Helps French Automotive and Special Vehicle Supplier Increase Global Turnover while Maintaining Qualityfebruari 14, 2018
Several years ago, automotive supplier EFA France realised they were expanding at a rate beyond which their current electrical design setup could manage. With plans to increase their global turnover, while maintaining the high level of quality in their products that had caused their business to prosper in the first place, they needed a new solution.
Advanced Packaging with Zuken’s CR-8000 Design Forcejanuari 31, 2018
Advanced packaging techniques such as system-in-package (SiP), fan-out wafer-level packaging (FOWLP), 3D die stacks, etc. have been around for over a decade, yet with any other EDA design tool, it is still a tedious, time consuming, and error-prone process to implement these designs. It seems surprising that there are so few reliable EDA solutions out there, but CR-8000 Design Force is definitely the tool to look to when tackling advanced package design! Take a look below and see why.
Four Steps for Avoiding Surprise In-Use Product Failuresjanuari 25, 2018
As we witness the birth of an era of connected devices with smart homes, connected cars and smart networked supply chains and factories, we might imagine that unexpected failures of electronic products would be a rarity. But all too often we hear about cellphones going up in flames, airbags that deploy on their own, or drones falling out of the sky. It is estimated that in the automotive industry alone, global warranties amount to as much as $40 billion USD per year.
Self-Driving Bus is 3D Printed in Only a Few Weeksjanuari 13, 2018
Traditionally, the automobile business spends a year or two designing a new vehicle, then another year or two building tools to produce it in high volumes. Local Motors has turned that paradigm on its head with its Olli, the self-driving, electric shuttle which is designed for use in neighborhoods, universities, corporate campuses, airports, etc. The Olli’s design can be customized to fit a customer’s application. Then the new design can be produced in small quantities with the aid of 3D printing in a few more weeks. Composite body panels are produced from 3D printed thermoforming molds and other 3D printed plastic parts are directly installed in the vehicle. “We believe that 3D printing will revolutionize the automobile industry by making it possible to quickly produce new vehicles to meet special applications and customer tastes,” said Matthew Rivett, Chief Operating Officer of Local Motors.
Tech Tip: Embedding Passive Components in Design Forcedecember 8, 2017
Ethernet Emerges as Communications Platform for Next Generation of Vehiclesnovember 1, 2017
Each new generation of automobiles has an increasing number of electronic systems that require communications with other vehicle systems at ever higher speeds. The proliferation of advanced driver assistance systems (ADAS) with fully autonomous vehicles on the horizon has greatly increased the amount of bandwidth that must be transferred between the many processors, cameras, radar units, display head units, etc. on current and next-generation vehicles. Today’s high-end vehicles have 70 or more electronic control units (ECUs) that implement hundreds of distributed functions including bandwidth-intensive applications such as collision lane departure warning systems, collision avoidance systems and automatic high-beam switching.
Zuken’s Design Solution for Multi-Board Systemsoktober 28, 2017
Over the course of the past couple of years, I’ve been digging deeper and deeper into system engineering. Very frequently, that means using methodologies to deal with the complexities of designing across multiple engineering disciplines. Yet, that’s not always the case. There are many instances where the complexity of a design is high within a single engineering discipline. That’s certainly true of today’s multi-boards systems and wire harnesses. Read more [source: lifecycleinsights.com]
Things to consider before investing in a new electrical engineering toolseptember 15, 2017
Feeling a bit dazed by the multitude of electrical applications available to you?
With Zuken’s E3.series containing a host of products including E³.schematic, E³.fluid, E³.cable, E³.formboard, E³.panel, E³.RoutingBridge, E³.PLCBridge and E³.Wiring Diagram Generator, you may feel overwhelmed on your first approach. Well, you’ve got nothing to worry about! I’ll walk you though and provide you with a guide to figuring it all out.
CADSTAR Redlining – Design Review and Markupseptember 12, 2017
A Few Thoughts on Avoiding DDR4 Layout Problemsseptember 5, 2017
DDR4, the fourth generation of DDR SDRAM technology, is the latest and greatest SDRAM standard and will continue to be until the fifth generation is released. The new standard features a point-to-point architecture that offers superior timing margins. In theory, this should make signal integrity easier to achieve since the designer has more leeway in routing and length matching of the different bit, clock and address lines, assuming operation at the same data rates. But most real-world designs are going to take advantage of DDR4’s ability to double the maximum rate and in this case routability will actually be considerably more challenging than with DDR3.
The Internet of Things and Modular Designaugustus 18, 2017
The advent of the Internet of Things (IoT) offers the potential to automatically collect detailed performance information from every device in the field at minimal cost. This field performance data can then be crunched to identify design weaknesses and improve product quality. The most powerful way to use this data is to reorganize the design process by basing it on modules that are continuously improved based on performance feedback.
Top 10 Ways to Improve Electrical and Harness Design in the All-New Release of E3.series 2017 – Part 1augustus 8, 2017
Zuken, with its E3.series suite, is leading the way in helping companies manage, design and develop products of tomorrow with electro-mechanical complexities such as panels, harnesses, PLCs, and fluid controls. The 2017 release is here to help you be faster, smarter and more effective in being a part of great electrical revolution taking over the broader society.
The 5 Top Design Issuesaugustus 1, 2017
At this year’s annual conferences (ZIW) across Europe we brought together leading companies in their fields to discuss some the latest electrical and electronic design issues affecting our customers including: ECAD/MCAD integration, PLM integration, augmented reality and PCB package co-design.
Zuken: Innovating Next Generation EDA Softwarejuli 26, 2017
In a world increasingly shaped by rapid progression and global market competition, there has been a call to arms in the fields of electrical engineering and design.
As an industry that’s long been defined by Printed Circuit Board-centered (PCB) processes and strategies, the journey to recovery from inherently flawed designs or oversights on budget can be long and incredibly costly. Lees meer [Bron: techwireasia.com]
Renishaw designs flex PCBs in true 3D with MCAD integration using Zuken’s CR-8000juli 18, 2017
The PCB design team at Renishaw work with flex PCBs and flexi-rigid boards that require detailed signal integrity analysis.
To achieve the most accurate results they are working with Zuken’s electronic PCB design software to visualize boards in 3D using imported MCAD data. This also ensures that sure high-speed digital signals can be transmitted with minimal distortion.
Predictive Failure Analysis Can Improve Product Quality – Part 1 of 2juni 15, 2017
We all know that manufacturing yields and costs are the driving force behind product development, rather than product quality. You can buy a Design for Manufacturing (DFM) tool, but try buying a Design for Quality tool – good luck! The best way of measuring product quality is finding out how your product performs in the hands of the customer. But measuring product performance, and quantifying quality, is difficult at best for most products. The good news is that more and more devices are becoming part of the Internet of Things (IoT), which extends the design team’s visibility beyond manufacturing – and that changes everything.
Is Fan-out Wafer-level Packaging Right for Your Product?april 22, 2017
New CAD tools feature virtual prototyping for evaluating effects of packaging architecture on functionality, cost, weight and size.
Fan-out wafer-level packaging (FO-WLP) technology has picked up considerable momentum since it was selected by Apple for use in the iPhone 7. FO-WLP establishes die-to-die and die-to-ball grid array (BGA) connectivity directly through packaging redistribution layers (RDLs), eliminating the packaging substrate used in more-established flip-chip and wafer-level chip scale packages (WLCSP). Read more [Source: pcdandf.com]
Zuken Partners with Nano Dimension to Develop Seamless Design to Manufacture for 3D Printingapril 8, 2017
Zuken and Nano Dimension are working together to advance the 3D printing user experience and prototype turnaround times. Nano Dimension, a leader in electronic printing technologies, will take advantage of the support for implementing electronic technologies provided by Zuken’s market-leading, native 3D, system-level design solution, CR-8000 Design Force.
Zuken Partners with SamacSys to Offer Rapid Component Creation for Seamless PCB Designjanuari 25, 2017
Zuken has partnered with SamacSys to help companies develop component libraries rapidly, freeing-up time for product innovation.
SamacSys, a leading developer of software tools for creating and managing electronic component ECAD data, has developed a library of free, high-quality PCB symbols and footprints for CADSTAR, Zuken’s desktop PCB design solution. This allows users to search and place components instantly from within CADSTAR, without needing to unzip or load files.
IoT Security – What Does It Mean For Electrical and Electronics Designers?december 24, 2016
In the electronics and electrical engineering design communities there is plenty of talk about IoT, particularly in relation to the opportunities, but arguably the more pressing issue right now is the need to design for security in the connected world. At the core of this is the concept of ‘trust’, consumers/businesses need to trust product manufacturers to deliver reliable robust products with the necessary defences against criminals. Forging ahead without appreciating the vulnerabilities that IoT security poses for individuals and companies seems irresponsible for those involved in the development and manufacture of connected devices. Video
Consistency – The Key to Business Successdecember 1, 2016
Consistency isn’t flashy or bragged about in our age of instant gratification. But it’s exactly what you need to thrive and set yourself apart in competitive business conditions. I caught up with Karl-Heinz Kluwetasch, Owner and Manager Director of CSK, who credits his CADSTAR Distributor of the Year 2015/2016 win to a combination of consistent support, customer contact through roadshows, and superior training all under one roof.
Zuken’s E3.series is Becoming the Tool of Choice for Motorsportnovember 4, 2016
Over the past year Zuken has seen a significant increase in the uptake of its E3.series electrical design tool within the motorsport sector. OEMs and suppliers, such as harness manufacturers, are citing a ripple effect that is causing companies to consider adopting E3.series based on word-of-mouth recommendations about the tool’s flexibility, ease of adoption and increased productivity.
Zuken and Aras Partner to Deliver Ideal EDM/PLM Environmentaugustus 26, 2016
Zuken®, and Aras®, a leader in enterprise Product Lifecycle Management (PLM) software, have entered into a partnership to develop a new approach for managing cross-discipline product development processes that include electrical and electronic design data from design creation to manufacturing. The new solution will span enterprise processes across the lifecycle, as well as detailed electrical design and manufacturing.
Kardinal Microsystems Joins Zuken USA Startup Partner Programaugustus 16, 2016
Kardinal Microsystems has joined Zuken USA’s Startup Partner Program aimed at early to mid-stage companies developing electronic-based products. The new program provides access to state-of-the-art PCB and IC packaging development tools, with special terms designed to accommodate the development needs of an early-stage company.
From Zuken Innovation World to the Race Track with Coburg Formula Student Race Teamaugustus 8, 2016
CAT Racing, the Zuken-sponsored Formula Student race team from Germany’s University of Applied Sciences Coburg made a strong appearance both at the ZIW Germany conference where we celebrated our 40th anniversary as a company and – even more important, one week later at the race track in Varano de´ Melegari in Italy, where the team secured a clear win in their class.
Working with the Defense Industry in Poland to Improve Electrical Designjuli 30, 2016
Here in Poland we are currently undergoing a major investment in our own defense capabilities. This may not come as a surprise to people outside of our country, given our geographical position in eastern Europe; not to mention the vast amount of military kit still in use that goes back to the old Soviet days.
Zuken Raises The Bar For ECAD/MCAD and Multi-user Efficiencies With CR-8000juni 7, 2016
Engineers facing extremely tight design cycles will benefit from powerful new multi-user functionality in Zuken’s CR-8000. Concurrent PCB design reduces design time, meaning quicker time-to-market. In addition, a raft of native 3D design enhancements offer more efficient ECAD/MCAD task management and design re-use, plus functionality enabling early validation to reduce iterations and improve design quality.
Zuken Introduces Perfect Springback Routing in CADSTAR 17juni 1, 2016
Special offers for CADSTAR PCB design software available now
Zuken announces industry-leading routing enhancements in the latest version of its CADSTAR desktop PCB design software. Other productivity enhancements include improved routing patterns for differential pairs, and Etch Factor support.
Zuken Comfortable in the Ring with EDA Heavyweightsmei 18, 2016
The most advanced production car in the world, the Tesla, is more a computer than a car. The old heart of the automobile replaced by batteries, chips, circuit boards and wiring. These days, a car will have 70 to 100 electronic control units (ECUs), which are based on microprocessors that sit on boards and boxes scattered throughout the vehicle, all connected with wires. For pure mechanical engineers, who in their heydays were at home among gears, pistons and shafts, life has become more complicated. Read more [Source: engineering.com]
Microsoft Selects Zuken’s DS-2 for Engineering Data Managementmei 10, 2016
Zuken announces that the Microsoft Devices division has selected Zuken’s DS-2 engineering data management solution for library and design data management with supply chain connectivity.
Zuken Conference Transforms PCB Design Landscapemei 4, 2016
CORONADO ISLAND, CA – During the past 35 years, end-to-end design has been a relatively backburner topic, but Zuken has designs on making that a thing of the past.
In doing so, the PCB software developer is attempting to “harness” what many see as today’s Holy Grail of system design.
Of course, if it hadn’t been for the abundant 30-minute technical sessions over the course of two days in mid April, attendees at Zuken Innovation World might be excused for feeling they were on vacation. [Source: pcdandf.com]
Zuken users now have access to more than 7 million symbols, footprints and 3D modelsapril 13, 2016
Zuken’s CR-8000 and CR-5000 PCB design platforms will now offer users access to more than 7 million symbols, footprints and 3D STEP models from Accelerated Designs.
IoT Makes Complex Design Problems Mass Market – Part 2februari 25, 2016
In the first part of this blog series (here), I looked at the explosion in the growth of internet connected technology and wearable devices, and started to look at what kind of design challenges this posed; not just for cutting edge niche products, but mass market general electronics goods.
I started to explore the need to collaborate on a mechanical level; but the level of integration really needed to compete in this space goes far beyond that.
Zuken: Going Meta on Automotive Designjanuari 27, 2016
Things are really heating up in automotive design and innovation. Last week, the Bosch ICCAD keynote about self-driving cars was covered here, and this week it’s Zuken’s latest automotive-related announcement regarding the launch of E3.HarnessAnalyzer and the acquisition of software IP from Intedis.
Zuken USA Expands Operations with CAETEK Inc. Acquisitiondecember 10, 2015
Zuken USA Inc announces the acquisition of CAETEK Inc. CAETEK is a software developer and sales partner for electrical design and manufacturing solutions. The addition of CAETEK will strengthen Zuken USA’s product portfolio and coverage in the electrical design space. CAETEK employees and intellectual property will transition to Zuken USA as part of the acquisition.
Zuken: Going Meta on Automotive Designnovember 26, 2015
Things are really heating up in automotive design and innovation. Last week, the Bosch ICCAD keynote about self-driving cars was covered here, and this week it’s Zuken’s latest automotive-related announcement regarding the launch of E3.HarnessAnalyzer and the acquisition of software IP from Intedis. Read more [souce: EDACafe]