The Netherlands have a unique ecosystem of OEM companies, subsystem suppliers, knowledge institutes and upcoming innovators that cooperate in developing High Tech Systems (HTS). As a result, the Dutch high tech industry is a major global contributor to development in fields of technology such as mechatronics, precision engineering, embedded systems, microsystems and nanotechnology. Technology already in use worldwide today, and innovative solutions for tomorrow. Dutch HTS provides the latest company news, furthermore it gives direct access to key-people in the Dutch High Tech Systems industry.
LATEST NEWS:
09/06/10 Impression of the 2010 'Meet and Match' event (YouTube movie) [Phillips App Tech]
Philips Applied Technologies' innovation event 'Meet and Match 2010' was held from May 25th - June 11th. At the event they showed that innovation by combination leads to sometimes surprisingly simple solutions to even tough
innovation challenges. Think of combining technologies,
expertise, or different experiences from different markets
and other companies, for example...
09/06/10 Scheuten Solar introduces HT glass on PV modules, Multisol® Vitro Module and Multisol® Gold Line [Scheuten Solar]
Scheuten Solar is introducing f | solarfloat HT (High Transmission) glass on the new P6-60 and P6-66 modules. This state-of-the-art glass features a proven innovative quartz- hard Anti-Reflection Coating – improving power output and energy yield. f | solarfloat HT glass is made by f | glass (a joint venture by Scheuten and Interpane) on one of Europe’s most advanced float glass productions lines, ensuring the highest quality available in the market...
09/06/10 NXP's MIFARE Plus chosen to power the ground transportation ticketing systems in Sochi, Russia in preparation for the 2014 Winter Olympics [NXP]
NXP today announced that its contactless microcontroller, MIFARE Plus™, has been chosen by the Russian city of Sochi – host of the 2014 Winter Olympics – to power the Automatic Fare Collection (AFC) system of its ground transportation network. This will be the first rollout of MIFARE Plus in Russia and the Commonwealth of Independent States...
09/02/10 NXP announces HDMI companion chip for mobile devices, providing level shifting for DDC, CEC and HPD [NXP]
NXP Semiconductors today announced the availability of a new HDMI companion chip for mobile devices, which provides bidirectional level shifting between the 1.8/3.3V (range between 1.62 and 3.63V) at the host side and the 5V of the HDMI connector side for the DDC (Display Data Channel), CEC (Consumer Electronics Control) and the HPD (Hot Plug Detect). All these lines, along with the HDMI 5V supply line, also offer a high level of ESD protection according to IEC61000-4-2, level 4...
09/02/10 Bom acquires interest in Sioux BinC (Dutch article) [Sioux]
De N.V. Brabantse Ontwikkelings Maatschappij (BOM) heeft een belang genomen in het aandelenkapitaal van Sioux BinC B.V., een spin-off van Sioux. BinC ontwikkelt en verkoopt volledig geautomatiseerde meldkamerdiensten. De investering is gedeeltelijk gefinancierd vanuit het spin-off fonds, opgezet door de provincie Noord-Brabant om kenniswerkers te steunen bij het opzetten van een eigen bedrijf ..
related item: view BOM news topic here (Dutch article)
09/01/10 Next-Generation NXP system basis chips address stringent EMC requirements of global car OEMs [NXP]
NXP Semiconductors today announced the release of the UJA107xA family, its next generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. Offering enhanced EMC (Electromagnetic Compatibility) performance, the chips meet the stringent requirements of global car OEMs such as Audi, BMW, Daimler, Ford, Porsche, Renault, Toyota and Volkswagen...
09/01/10 FEI unveils new capabilities for natural resource extraction [FEI]
FEI Company announces the availability of two new software solutions that provide quantifiable data to improve natural resource extraction. In addition, FEI announces that its popular QEMSCAN(R) software is now available on the Quanta(TM) 650 scanning electron microscope (SEM) platform. The new software upgrades are part of FEI's automated mineralogy technology suite, a high throughput analysis solution that provides quantitative mineralogical data on a wide range of geological samples...
08/31/10 ASM International publishes Interim Financial Report for the six-month period ended June 30, 2010 [ASMi]
ASM International today published its Interim Financial Report for the six-month period ended June 30, 2010. This report includes an Interim Management Board Report, a responsibility statement and Consolidated Interim Financial Statements prepared in accordance with IAS 34 (Interim Financial Reporting). The Interim Financial Report comprises regulated information within the meaning of the Dutch Financial Markets Supervision Act...
08/31/10 Good first half year for the VDL Group [VDL ETG]
The VDL Group of Eindhoven achieved a combined turnover of €746 m in the first half of 2010. That is 10% higher than for the first half year of 2009 (€678 m). The result after taxes was also considerably higher: a profit of €26.5 m halfway through 2010 compared to €5.4 m at the midpoint of 2009. The balance position remains strong with a solvency of more than 52%. As a result of the growing order inflow, the number of employees has also risen: from 6,113 employees at the end of 2009 to 6,776 in mid-2010...
08/30/10 Solland Solar and Schott Solar sign partnership agreement [Solland Solar]
Schott Solar and Solland Solar signed a partnership agreement that comprises technology license agreements, joint R&D efforts and joint production for back-contacted solar modules. Because of less solar-cell shadowing and minimized resistive losses the technology allows for far better efficiency rates. Both parties target serial-production
of modules with an efficiency up to 16% on module level by 2011…
press release (PDF File)
related item: view Schott Solar news item here
08/26/10 NXP IC Enables up to 98 percent efficient power extraction in Solar PV Applications [NXP]
NXP today announced the availability of the MPT612 – a unique low-power IC dedicated to performing the Maximum Power Point Tracking (MPPT) function for applications using solar photovoltaic (PV) cells or fuel cells. Supported by a patent-pending MPPT algorithm, the MPT612 IC can deliver up to 98-percent efficient power extraction in applications such as solar battery charge controllers, distributed MPPT and micro-inverters...
08/25/10 Texim Europe introduces industrial-grade modularized IP65 touch panel PC [Texim]
Texim Europe introduced the LPC-1203 Touch Panel PC from Avalue Technology. The LPC-1203, achieves a full IP-65 compliance and integrated with a variety of innovative technologies. The fanless LPC-1203is powered by Intel®Atom™ N270 processor which reduces the power consumption and has an embedded and unique heat dissipation
trench design...
08/19/10 NXP selected to secure new German national identity card [NXP]
NXP Semiconductors today announced that its SmartMX secure contactless microcontroller chip has been chosen to power the new German contactless National Identity card (Neuer Personalausweis). The German government has selected NXP as the supplier of an inlay solution containing a dedicated SmartMX chip, packaged in an ultra-
thin module...
08/19/10 Multi Fluid Multi Range gives flexibility and cost reduction [Bronkhorst]
Digital Mass Flow Meters and Controllers for gases of Bronkhorst High-Tech’s Select series offer greater flexibility for user selection of both flow ranges and gas types. As a result of their ‘MultiFluid Multi Range’ feature in combination with a high rangeability (up to 187.5:1), equipmentmanufacturers (OEMs) are able to drastically reduce the variety of spare instruments they keep on stock
and thus reduce the cost of ownership...
08/19/10 Comsol multiphysics simulation software selected product of the year finalist by NASA Tech Briefs magazine [Comsol]
ComsolL Inc. announced that the newly released COMSOL Multiphysics® version 4.0 has been selected the NASA Tech Briefs 2010 Product of the Year Finalist. The winner was chosen by NASA Tech Briefs’ editors for its outstanding technical merit and practical value to the magazine’s 400,000 engineering and scientific readers...
08/17/10 NXP Semiconductors announces second quarter 2010 results [NXP]
Sales were $1,201 million in the second quarter of 2010, a comparable increase of 43.6% from the second quarter of 2009 and a comparable increase of 6.5% compared to the first quarter of 2010. The increase was visible across all business segments and regions. Income From Operations in the second quarter of 2010 was $93 million compared to a loss of $217 million in the second quarter of 2009 and breakeven in the first quarter of 2010...
08/17/10 Apple testing proximity-powered prototypes today; likely to appear in iPhone 5 (Source: Techcrunch.com)
Over the weekend it was reported that Apple hired Benjamin Vigier, an expert in near field communication (NFC), a short range wireless protocol most synonymous with contactless payments. This key Apple hire is perhaps the strongest public signal yet of Apple’s intent to use NFC to build on its micropayments franchise and disrupt traditional
point of sale using a mobile commerce model...
08/13/10 Assembléon robot reduces cost of memory module and back end semiconductor manufacturing [Assembléon]
Royal Philips Electronics subsidiary Assembléon’s recently released Twin Placement Robot (TPR) is reducing the cost of placement for memory module assembly, and will soon be doing the same for semiconductor backe nd manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour, eliminating
the need for a separate line balancing machine...
08/12/10 PV module costs and prices, what is really happening? (Source: PV-tech.org)
It is earnings call season once again for solar PV module suppliers, and looking at the results of a number of the major suppliers, Q2’10 looks set to continue the market’s recent record setting trend. A few things immediately stand out from the first few calls this quarter...
08/12/10 NXP releases 2009 Sustainability Report [NXP]
NXP Semiconductors announced today the publication of its Sustainability Report for 2009. The report, “High Performance Mixed Signal: Innovations for a better tomorrow,” explains how NXP products are helping to enable society as a whole to reduce energy consumption; describes the performance of NXP itself with regard to sustainability; and outlines how the company is working toward sustainable growth in the future...
view full PDF report here
08/06/10 NXP announces pricing of its initial public offering [NXP]
NXP Semiconductors announced today that its initial public offering of 34,000,000 shares of common stock will be priced at $14 per share. The shares are scheduled to begin trading August 6, 2010, on the NASDAQ Global Select Market under the ticker symbol “NXPI.” The offering’s underwriters will have a 30-day option to purchase up to 5,100,000 additional shares of common stock at the initial public offering price…
