02/02/12 NXP announces new benchmark in miniaturization
NXP today announced to have set a new benchmark in miniaturization with the launch of its next-generation family of low VF Schottky rectifiers, targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new plastic package is the smallest on the market that is capable of carrying a current of up to 1.5A. Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors, said: “These devices are a real breakthrough in terms of both miniaturization and current density for mobile device designers, giving them functionality options not previously available at this size.
01/13/12 NXP demonstrates solar-powered street lighting solution
NXP today announced that it has developed an innovative, sustainable and highly efficient solar-powered street lighting solution, together with Philips Lighting. The groundbreaking Solar Gen2 solution, which NXP is demonstrating this week at CES 2012, could have a major impact on energy consumption in urban areas at night. By charging street lamps during daylight hours, the new solar-powered solution from Philips Lighting and NXP can supplement the capacity of the conventional electricity grid, saving money and reducing CO2 emissions.
01/09/12 NXP launches ultra-compact, high-precision MEMS frequency synthesizer
NXP today unveiled its ultra-compact, high-precision MEMS-based frequency synthesizer, which presents a compelling alternative to quartz crystal-based timing devices. NXP’s MEMS technology replaces a quartz crystal with a bare silicon die that is more than 20 times smaller than the smallest crystal available today. The MEMS die does not require any dedicated, quartz-like, ceramic or metal-can hermetic package. Instead, it can be merged with other IC’s into a standardized, low-cost plastic package.
01/05/12 Treehouse Labs and NXP unveil BiKN technology platform
Seeking to revolutionize the way mobile networks and applications for control, tracking and monitoring are delivered, Treehouse Labs today unveiled the BiKN™ Technology Platform. The Platform uses low-power wireless chip technology from NXP to enable the “Internet of Things,” opening entirely new markets and applications for affordable wireless sensor and control networks. The thesis behind the BiKN Technology Platform is three-fold: Integrate hardware and software; operate through mobile and web-enabled devices; and leverage a patented advantage by using IEEE802.15.4 low-power networking standards enabling rapid creation and scalability of sensor and remote control networks while reducing current development costs.
12/05/11 NXP ships world’s fastest ARM Cortex-M4 and Cortex-M3 microcontrollers
NXP Semiconductors today announced the availability of the LPC4300 Digital Signal Controller (DSC) – at 204 MHz, the world’s fastest ARM® Cortex™-M4 processor. The LPC4300 is the industry’s first asymmetrical dual-core DSC with a Cortex-M0 co-processor. Also today, NXP announced that it has increased the performance of its LPC1800 series to 180 MHz, extending its lead as the world’s fastest Cortex-M3-based microcontroller. Designed in parallel, the LPC4300 and LPC1800 have been manufactured using the same ultra-low leakage 90-nm technology, are pin- and software-compatible, and share many key features.
11/21/11 NXP launches industry’s first medium power transistors in 2x2-mm leadless DFN package
NXP Semiconductors today announced the industry’s first medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) Surface-Mounted Device (SMD) plastic package, the BC69PA transistor is the first in a family of medium power transistors from NXP available in a miniature form factor. Ideally suited for general-purpose power-sensitive applications in mobile, automotive, industrial and household appliances, the new DFN2020-3 (SOT1061) packaging can save up to 80 percent more space on the PCB compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 Amps.
11/02/11 NXP’s NFC solution implemented in Google’s Galaxy Nexus
NXP Semiconductors today announced that the recently launched Galaxy Nexus™ from Google™ incorporates NXP’s fully integrated near field communication (NFC) solution PN65N. Featuring a NFC radio controller and an embedded Secure Element, the PN65N is also fully validated and integrated on the latest release of Android™ 4.0, also refered to as Ice Cream Sandwich. The availability of NXP's
open-source NFC software on Ice Cream Sandwich enables
mobile phone and now also tablet manufacturers to quickly
and easily design NFC-enabled, Android-based mobile devices.
11/01/11 NXP reports Q3 2011 Results
NXP Semiconductors today reported financial results for the third quarter 2011, ended October 2, 2011, and provided guidance for the fourth quarter 2011. Product Revenue from continuing operations was $970 million, an increase of 3.6 percent from the $936 million of Q3 2010, and a decrease of 5.4 percent from the $1,025 million reported in Q2 of 2011. Total revenue from continuing operations was $1,060 million, a decrease of 5.4 percent from the $1,120 million of Q3 2010 and a decrease of 5.4 percent from the $1,121 million in Q2 of 2011. “During the third quarter NXP delivered revenue around the lower end of our original guidance, as customer order-rates slowed in response to the uncertain macro-economic environment,” said Richard Clemmer, NXP Chief Executive Officer."
09/26/11 NXP unveils industry’s first Cortex-M0 microcontrollers with integrated segment LCD drivers
NXP Semiconductors today introduced the LPC11D00 and LPC12D00 series of microcontrollers – the first ARM® Cortex™-M0 microcontrollers with integrated segment LCD drivers, enabling high contrast and brightness in a single chip. Featuring the NXP PCF8576D LCD driver, the LPC11D00 and LPC12D00 are capable of driving any static or multiplexed Liquid Crystal Displays containing up to 4 backplanes and 40 segments, and can be easily cascaded with multiple segment LCD drivers to accommodate up to 2560 segments for larger display applications...
09/19/11 NXP enhances NFC tag IC portfolio
improved sensitivity enables smaller tags, higher read range
NXP today introduced the NTAG203 NFC Forum-compliant Type 2 tag, the newest family of integrated circuits to enhance the deployment of NFC tags for OEMs, inlaycustomers and end users. As customer interest in NFC continues to grow, NXP has responded with the NTAG2 family of NFC tag solutions to effectively deploy NFC in emerging use cases. Applications such as smart posters, social media, service discovery, and electronic enhancement of printed media can all leverage the simplicity of a tap of the NTAG203-based tag to seamlessly retrieve data...
09/13/11 NXP introduces USB 3.0 SuperSpeed redriver
PTN36241B supports 5Gbps per channel with richest feature set in the market
NXP Semiconductors today announced the release of a breakthrough USB3.0 SuperSpeed redriver, the PTN36241B – a dual-channel device that supports 5 Gbps per channel with optional settings that provide a high level of extendability. As computing systems become faster, signal integrity tends to deteriorate more rapidly than in slower systems. The PTN36241B redriver provides signal equalization on a weakened signal, followed by transmit de-emphasis, thus maximizing link performance, enhancing signal integrity and improving system reliability...
08/23/11 NXP delivers world's first no-offset I2C-bus buffers
Unique bus buffers drive I2C-bus signals over long distances, interface with other bus buffers
NXP today introduced the PCA9525 and PCA9605 – the industry’s first no-offset I2C-bus buffers, which enable system designers to isolate capacitance and interface with other bus buffers. These groundbreaking bus buffers use the no-offset scoreboard method to decide signal direction, rather than using a directional pin and relying on offset voltages to control direction and prevent bus latch-up. Significantly, the no-offset devices are interoperable even with static offset or incremental bus buffers, allowing easy design-in regardless of which other devices are on the bus..
08/18/11 NXP introduces partial networking solution for vehicles
Milestone in CO2 reduction and energy efficiency
As governments around the world call for a reduction in CO2 emissions from vehicles, auto manufacturers are increasingly focused on finding ways to produce more environmentally-friendly vehicles. As such, car manufacturers are now pushing for CAN Partial Networking – a major innovation in power efficiency - to become an industry standard via ISO and AUTOSAR. NXP Semiconductors today announced the first NWP ISO 11898-6 and AUTOSAR R3.2.1 compliant solution supporting CAN Partial Networking. The stand-alone TJA1145 CAN transceiver and system basis chip UJA1168 – the world’s first highly integrated solution to support CAN Partial Networking – give design engineers precision control over a vehicle’s bus communication network...
08/11/11 NXP drives miniaturization with ultra-compact power management solution for portable devices
Combined two-in-one Low VCEsat Transistor and Trench MOSFET comes in 2x2 mm leadless package
NXP Semiconductors today announced the PBSM5240PF, an ultra-compact Medium Power transistor and N-channel Trench MOSFET housed in a leadless DFN2020-6 (SOT1118) plastic package. Measuring only 2 x 2 mm and with a height of just 0.65 mm, the DFN2020-6 (SOT1118) has been designed in response to the industry trend for miniaturization in high-performance consumer products such as mobile devices. As one of the first power management solutions on the market to integrate a low VCE(sat) BISS transistor and Trench MOSFET into a 2-in-1 product, the PBSM5240PF saves space on the PCB, while delivering high electrical performance...
07/29/11 NXP Semiconductors Reports Second Quarter 2011 Results
NXP today reported financial results for the second quarter 2011 and provided guidance for the third quarter 2011. “NXP delivered revenue growth during the second quarter at the high end of our original guidance with all of our business lines delivering sequential revenue growth,” said Richard Clemmer, NXP Chief Executive Officer. “Our quarterly performance marks the ninth consecutive quarter of sequential product revenue growth, a demonstration of the continued customer adoption of our overall product portfolio...
07/28/11 New generation of position sensors improves performance of automotive applications
NXP Semiconductors today announced the release of a new generation of automotive position sensors, KMA210. The KMA210 incorporates NXP’s latest magnetoresistive sensor chip and a unique signal conditioning ASIC developed in NXP’s advanced Silicon on Insulator (SOI) ABCD9 process technology. It is the first of a new magnetic sensor family in a full system-in-package solution that requires no external components. KMA210 is specially designed to improve the overall performance and increase robustness in automotive applications...
07/20/11 NXP Introduces Transmission Line ESD Protection for HDMI Transmitters
IP4786 is industry’s only complete HDMI 1.4 signal-conditioning and protection IC
NXP Semiconductors today announced the IP4786CZ32, a highly integrated HDMI signal-conditioning IC which provides the industry’s highest levels of protection for HDMI 1.4 transmitter applications. Featuring a unique Transmission Line Clamping architecture that provides lower peak clamping voltages during an ESD strike, the IP4786 delivers strong ESD protection, the best signal integrity and the highest level of integration available in the industry today...
06/22/11 NXP unlocks the potential of multifunction car keys
Pioneering the market for ‘smart’ car keys, NXP Semiconductors today announced the availability of its production-ready single-chip solution for multifunction car keys - the NCF2970 (KEyLink Lite). Enhancing the functionality of car keys by supporting Near Field Communications (NFC) technology, NXP’s KEyLink Lite enables car manufacturers to offer a new driving experience with keys that connect to external NFC-compliant devices, such as mobile phones, tablets and laptops. The launch of KEyLink Lite is timed to take advantage of the growing popularity and availability of NFC. Drivers will be able to simply wave their car key over an NFC-compliant mobile device to access essential and useful car data...
06/16/11 Sony Ericsson selects NXP’s NFC solution for its Android-based Smartphone
Today NXP Semiconductors announced that its near field communication (NFC) technology has been selected by Sony Ericsson for inclusion in its Android-based smartphones. Sony Ericsson will use NFC to further enhance its consumers’ mobile experiences, creating a portfolio of smartphones that enable mobile transactions. Using simple touch gestures, consumers will be able to
make purchases or connect to a point of sale (POS) terminal,
ticketing terminal or location-based promotional tag simply
and securely with their NFC-enabled smartphones...
06/14/11 NXP small-signal MOSFET’s set new benchmark in RDS(on)
New portfolio enables increased power efficiency for mobile computing, communications and other consumer applications
NXP Semiconductors today announced a new family of small-signal MOSFETs delivering breakthrough low RDS(on) performance. The low RDS(on) P-Channel and N-Channel MOSFETs enable lower power consumption for consumer electronics applications such as notebooks, tablets, handsets, e-readers, set-top-boxes and LCD TVs. These high-efficiency MOSFETs are available in high-volume SOT23 and SOT457 packages with a compact 3-mm x 3-mm footprint, allowing design engineers to replace larger package types with significantly smaller solutions offering similar or better on-resistance...
06/08/11 NXP introduces eXtremely rugged XR LDMOS RF power transistors
New XR family offers best-in-class ruggedness and performance without added cost
Designed for the toughest engineering environments, NXP Semiconductors today unveiled its new XR family of “eXtremely Rugged” LDMOS RF power transistors. The XR
family is designed tough-as-nails to withstand the harsh fault
conditions often found in applications such as industrial lasers,
metal etching and concrete drilling. Based on NXP’s industry-
leading LDMOS technology, the XR family extends LDMOS into
the few remaining domains that are serviced by VDMOS and
bipolar transistors today...
06/01/11 NXP’s NFC partner program debuts in China and Taiwan
NXP installs a unique ecosystem to enable NFC adoption across devices and applications
NXP Semiconductors today announced the launch of the first near field communication (NFC) Partner Program to support mobile phone and consumer device manufacturers wanting to integrate NFC into upcoming designs in China and Taiwan. Since the co-creation of the NFC standard and the NFC Forum, NXP has been at the forefront of developing this market by bringing all industry partners together. Starting at the heart of the creation of the ISO standards, NXP has continuously contributed to the industry with a distinctive blend of market-making alliances and unrivalled technical excellence. The mobile transactions market has evolved into a rich ecosystem with very diverse applications demanding a complete portfolio of solutions...
05/31/11 NXP announces availability of LPC1788
120-MHz ARM Cortex-M3 MCU also features Ethernet, USB and External Memory Controller
NXP Semiconductors today announced availability of its LPC1788 microcontroller – the industry’s first ARM® Cortex™-M3-based MCU to be shipping in volume with an
integrated LCD controller. With up to 96 KB of on-chip SRAM
and a 32-bit external memory interface, the LPC178x series
allows customers to easily and cost-effectively add high-quality
graphics to their applications. With support for a wide range of
graphics display panels, the LPC178x series is ideal for industrial
automation, point-of-sale, and medical diagnostic applications...
05/27/11 NFC Enables Secure Mobile Transactions for Google Wallet
Today NXP Semiconductors announced that its world leading near field communication (NFC) technology enables the newly announced Google Wallet. NXP joins partners Google, Citibank, MasterCard, First Data, and Sprint, along with other market leaders, in New York to unveil Google Wallet, an open platform enabling mobile transactions. With NXP’s secure contactless NFC solution, consumers can simply wave their phones over intelligent surfaces to pay for goods, apply a discount coupon, or receive loyalty points. Google Wallet allows consumers to replace a multitude of physical cards typically carried in wallets with a NFC enabled phone delivering convenience, personal interactivity and security for many different types of transactions...
05/17/11 NXP demonstrates new car-to-x communication platform
Major milestone towards safer road traffic
NXP Semiconductors this week gave a live demonstration of car-to-x (C2X) communication on a public road in the Netherlands. With this demo, NXP is the first semiconductor
company to take the step from showing concepts to actually
demonstrating an automotive-ready hardware platform for
connected mobility. NXP has co-developed the C2X platform
with Australian-based Cohda Wireless. Combined with
telematics for location-based services and networking
security, the platform enables the fully connected car
and is therefore a major milestone towards mass
deployment for safer road traffic...
05/16/11 An internet address for every light bulb
NXP’s GreenChip smart lighting solution opens an entirely new dimension in energy efficient lighting
What if every light bulb had its own unique Internet IP address? The possibilities are endless: You could monitor, manage and control every light bulb from any Internet-enabled device – turning lights on and off individually, dimming or creating scenes from your smartphone, tablet, PC or TV – to save energy as well as electricity costs. Your “smart lighting” network could have dozens or even hundreds of appliances connected through a wireless network designed for maximum energy savings, communicating information about their environment, about power consumption levels, and alerting you to any problems. Today, NXP is introducing its GreenChip™ smart lighting solution that makes the Internet-enabled, energy-efficient lighting network a reality – not only for businesses, but also for consumers trying to make the most of energy savings in the home...
05/11/11 MIFARE4Mobile Industry Group Announces Roadmap
The MIFARE4Mobile Industry Group, consisting of leading players in the Near Field Communication (NFC) ecosystem including Ericsson, Gemalto, Giesecke & Devrient, NXP Semiconductors, Oberthur Technologies, STMicroelectronics and ViVOtech, today announced the new roadmap for MIFARE4Mobile™ specifications. The companies are collaborating to integrate support for the following new features and technologies in the next version 2.0 of the MIFARE4Mobile specifications..
05/04/11 NXP Semiconductors reports first quarter 2011 results
Product Revenue from continuing operations of $979 million, up 4.4 percent sequentially
GAAP Gross margin 46.8%
GAAP Operating margin 10.0%
GAAP Earnings per share $0.73
Non-GAAP Gross margin 47.8%
Non-GAAP Operating margin 20.6%
Non-GAAP Earnings per share $0.46
“NXP delivered better than anticipated top-line revenue during the first quarter as nearly all of our focus segments out-performed our original expectations,” said Richard Clemmer, NXP Chief Executive Officer. “Our quarterly performance successfully demonstrates NXP's strategy to focus on the faster growing High Performance Mixed Signal market, and to opportunistically service the broad-based Standard Products market...
05/03/11 NXP announces the world’s highest performance RF Digital-to-Analog Converter
Significant circuit innovations enable linearity performance breakthroughs
NXP Semiconductors today announced the DAC1627D – a 16-bit dual-channel LVDS DDR interface Digital-to-Analog Converter (DAC) which supports output update rates of up to 1.25 Gsps. In terms of dynamic performance specifications, this new high-speed DAC offers best-in-class single tone SFDR performance and two-tone intermodulation distortion over a broad output bandwidth of 200 MHz...
04/27/11 NXP announces CGVxpress High Speed Serial Interface
New CGVxpress extends high speed serial interface leadership providing higher bandwidth, deterministic latency and harmonic clocking for WIFR, ISM and A&D applications
NXP Semiconductors today announced CGVxpress™, an important extension to its high speed data converter technology portfolio and the next generation of the CGV™ high speed serial interface announced in 2009. The newly announced CGVxpress will be used in future NXP ADC and DAC product families. The first demonstration of CGVxpress will occur at booth #420 of the IEEE International Microwave Symposium (MTT-S) held June 7-9, 2011 in Baltimore, Maryland. NXP will showcase a 4.5 Gbps CGVxpress transmitter interworking with an industry standard FPGA over a 20 cm differential data lane...
04/21/11 NXP “Anubhav” University program launches “Automotive Center Of Excellence” at I 2 IT
New Automotive Centre of Excellence founded in Pune to foster automotive research and product development
NXP Semiconductors today inaugurated the Automotive Centre of Excellence (ACE) in Pune in association with the International Institute of Information Technology (I 2 IT). Located at I 2 IT Pune Campus,this Center of Excellence will provide unique infrastructure and collaboration of the industry and academia. The center will foster the innovation in the field of automotive electronics and would provide students, faculties, automotive Original Equipment Manufacturers (OEMs), automotive sub-assembly suppliers and industries in the region with expert technical support for product development and research activities to address market demands. In January 2011, NXP had announced an elaborate initiative called NXP ‘Anubhav’ to set up state-of-the-art labs at top engineering institutes in India and the Automotive Center of Excellence is a step in the direction...
04/18/11 NXP and Poken to join forces to develop NFC products for social networking
Poken SA announced its collaboration with NXP Semiconductors at WIMA 2011, Poken will launch the first end-to-end NFC compliant platform for social networking, extending the benefits and productivity enhancements of existing social media tools to the real world. The new platform adds to Poken’s product portfolio by adding NFC-based loyalty, payment, and access control capabilities to an already-successful range of social media products...
04/16/11 NXP Ships 500 Millionth ABS Sensor Module
Continental ABS wheel speed sensors feature MR speed sensor modules from NXP
NXP Semiconductors today announced that it has shipped more than half a billion ABS speed sensor modules – a key milestone in NXP’s relationship with Continental, one of the leading global automotive suppliers. The Chassis & Safety
Division of Continental has worked closely with NXP to develop
advanced ABS/ESC sensor modules that are now used by most
car manufacturers in the world, in both the standard and high-end
segments of the market...
04/04/11 NXP aids “No Sponge Left Behind” in surgical procedures
RFID-based SmartSponge System helps prevent retained foreign objects in surgical patients
NXP Semiconductors announced that ClearCount Medical Solutions has selected NXP RFID solutions to enable its SmartSponge® System. The SmartSponge System can easily and accurately detect and account for surgical sponges placed in a patient’s body when undergoing surgery, so that no items are “left behind,” thus improving patient safety. The SmartSponge System is comprised of RFID-enabled surgical sponges; an embedded RFID reader within a user-friendly automated software accounting system; an accompanying SmartWand to detect sponges accidently retained within the body; and a smart disposal system to account for discarded sponges...
03/29/11 NXP releases world’s smallest logic packages for handheld mobility
6- and 8-pin plastic leadless packages up to 60 percent smaller with improved mechanical performance and robustness
NXP today announced the world’s smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch. The ultra-compact packaging design is ideal for leading-edge
portable handheld devices such as smartphones, tablets and SD
cards where chip and board space comes at a premium.
The SOT1115 package decreases package size by 10 percent for
the 6-pin version compared to the previous smallest package,
SOT891, of which NXP has produced over one billion units...
03/23/11 NXP releases LIN transceiver with integrated voltage regulator in compact package
TJA1028 enables robust nodes in LIN bus systems
NXP today announced the TJA1028, a LIN transceiver family with an integrated low-drop voltage regulator in a very small 3x3mm leadless package. The voltage regulator is designed to power an automotive Electronic Control Unit (ECU), integrating the major peripheral functions around the microcontroller of a typical LIN-networked ECU into a single chip. The combination of voltage regulator and bus transceiver makes it possible to develop compact yet powerful slave nodes in LIN bus systems...
03/08/11 NXP builds a smarter way to energy efficiency with world's lowest standby power
Highly efficient family of GreenChip low-power adapters saves money and energy
NXP today announced a new generation of GreenChip™ power solutions which feature the lowest standby capability in the industry, reaching levels below 10mW.
The NXP GreenChip power ICs, also known as Switch Mode
Power Supply controller ICs, are designed for adapters for
mobile devices such as cell phone chargers, tablets and
notebooks, as well as major home appliances or white goods...
02/28/11 NXP and ARM extend strategic licensing agreement for microcontrollers
NXP Semiconductors and ARM today announced that they have expanded their strategic relationship with a long-term subscription licensing agreement around the ARM® Cortex™-M series processors for microcontrollers. Under the agreement, NXP will also be working with ARM in developing and expanding its future microcontroller roadmap in areas including performance and energy efficiency...
02/22/11 NXP expands ARM Cortex-M0 microcontroller portfolio with LPC1200 Industrial Control Series
Over 50 Flash and SRAM size options with configurable peripherals optimized for energy-efficient controls and appliances
NXP today announced its LPC1200 Industrial Control Series featuring the ARM® Cortex™-M0 processor. The LPC1200 extends NXP’s 32-bit ARM microcontroller continuum and
targets a wide range of industrial applications in the areas
of factory and home automation, such as white goods,
motor control, power conversion and power supplies.
It also expands NXP’s Cortex-M0 microcontroller offering
with a wide range of Flash memory sizes.
02/14/11 NXP brings smart card security to device authentication
Secure au10tic microcontrollers feature banking-grade security technology to combat counterfeit devices
NXP today announced the au10tic™ family of secure ICs designed specifically for device authentication. The au10tic secure microcontrollers are based on NXP's proven security technology, which has been widely used for securing government ID cards and passports, as well as smart cards for banking and other high-security applications. Offering easy integration into end devices, the NXP au10tic ICs provide a complete tamper-resistant security solution including key generation and programming services, as well as the option for remote management of applications and credentials running on the secure MCU...
02/11/11 Oberthur and NXP announce licensing agreement for MIFARE on SIM card
Agreement aims to boost NFC payment and ticketing services
NXP and Oberthur Technologies, announced today a licensing agreement for NXP’s MIFARE™ technology. This agreement enables Oberthur Technologies to integrate MIFARE™ into its SIM cards globally. This will further drive the adoption of NFC-enabled phones in infrastructures such as public transit, event ticketing, customer loyalty programs and access control around the globe. Under this agreement, Oberthur Technologies will expand its existing UICC product portfolio adding MIFARE DESFire™ and MIFARE Plus™ technology...
01/27/11 Atos Origin and NXP introduce end-to-end security in the smart grid
Atos Worldline and NXP today announced a unique end-to-end security and authentication solution designed to protect Smart Grid networks against energy theft, privacy breaches and grid attacks. The solution brings Atos Worldline’s ESS (Energy Security Service) and Atos Worldline’s SMP (Smart Meter Personalisation) together with secure last-mile devices and authentication technology from NXP...
01/24/11 NXP launches Android application
NXP Semiconductors today introduced the NXP Android application, allowing easy and fast access to NXP’s complete product portfolio. The free mobile application allows engineers to search, buy and share information on over 10,000 products from NXP’s High Performance Mixed Signal and Standard Products portfolio anytime, anywhere...
01/17/11 NXP appoints Jeff Palmer as Vice President, Investor Relations
NXP Semiconductors today announced the appointment of Jeff Palmer as Vice President, Investor Relations, reporting directly to Karl-Henrik Sundström, Executive Vice President and Chief Financial Officer. Palmer joins NXP having worked in the semiconductor and financial industry for over 25 years, most recently serving as Vice President, Investor Relations for Marvell Technology Group...
01/12/11 NXP Announces Industry’s First Integrated CAN Transceiver Microcontroller Solution
Complete CAN system offers increased overall quality and reliability while reducing total network costs
NXP Semiconductors today announced the LPC11C22 and LPC11C24 – the industry’s first integrated high-speed CAN Physical Layer transceiver and microcontroller with easy-to-use on-chip CANopen drivers. Offered as a unique System-in-Package solution, the LPC11C22 and LPC11C24 with integrated TJF1051 CAN transceiver combine complete CAN functionality into a low-cost LQFP48 package...
01/10/11 NXP kicks off High Performance RF Design Challenge
Prizes worth $25,000 for most creative application ideas for RF power devices
NXP Semiconductors N.V. (Nasdaq: NXPI) has now opened registration for its first-ever High Performance RF Design Challenge, inviting RF engineers and students worldwide to submit creative application ideas for RF power devices. RF power transistors have traditionally been used in telecommunications, aerospace and broadcast infrastructure, as well as various industrial, scientific and medical applications...
12/16/10 NXP delivers silicon TV tuner integrating immunity to wireless network interference
TDA18273 supports worldwide analog and digital TV standards
NXP Semiconductors N.V. today announced the TDA18273, a unique silicon tuner integrating immunity to wireless
network interference from wireless LAN and mobile phones.
This is particularly important as a growing number of TV's
today introduce WLAN IP TV or Google TV capability...
12/13/10 NXP announces first multi-standard digital radio co-processor for car entertainment
SAF356x features software to support HD Radio, DAB, DAB+ and T-DMB standards
NXP Semiconductors today announced the availability of the SAF356x series, a flexible digital radio co-processor for car entertainment systems supporting DAB, DAB+ and T-DMB reception, as well as HD Radio. All standards are supported for both single- and dual-tuner applications. The SAF356x is the market’s first multi-standard baseband processor for digital terrestrial radio systems, with software that can be modified to support additional features in the future, including standards such as DRM or DRM+...
12/06/10 Google and NXP integrate NFC in Android 2.3
Today NXP Semiconductors announced a strategic collaboration with Google™ to provide a complete open source software stack for Near Field Communications(NFC). The NFC stack will be fully integrated and validated on Gingerbread, the latest version of the Android™ platform. Google also integrated NXP’s NFC controller (PN544) into its newly launched Nexus S™ phone, co-developed by Google and Samsung, offering users access to compelling NFC based services and applications...
12/01/10 NXP Unleashes SmartMX2 Microcontroller for Secure Multi-Applications
NXP Semiconductors today launched the SmartMX2™ – an all-new family of secure microcontrollers built on the groundbreaking IntegralSecurity™ architecture. The SmartMX2 is designed to provide unprecedented levels of security for multi-applications without compromising on convenience, performance or design productivity...
11/29/10 NXP Unveils 30V MOSFET with Industry’s Lowest RDSon
NXP Semiconductors today unveiled the first MOSFET in the NextPower range with a 30V Power-SO8 MOSFET, featuring the industry’s lowest RDSon of 1.4mOhm at 4.5V. The new MOSFET, PSMN1R0-30YLC, is optimized for 4.5V switching applications and is packaged in LFPAK, the industry’s toughest Power-SO8 package...
11/25/10 NXP and Gemalto sign licensing agreement for adding MIFARE to UICC cards
NXP Semiconductors N.V. and Gemalto announced a global strategic licensing agreement for NXP’s MIFARE™ technology, enabling Gemalto to integrate MIFARE into its UICC cards. This cooperation aims at spurring the usage of NFC mobile devices in the MIFARE infrastructure, therefore accelerating worldwide deployments of mobile contactless services...
11/09/10 NXP to drive automotive LEDs with automotive-qualified technology
NXP Semiconductors today announced the availability of fully integrated, highly flexible driver IC solutions designed for vehicle LED headlights and tail lights, based on automotive-qualified technology. The ASL1010NTK and ASL1010PHN are the industry’s first automotive LED driver ICs to integrate critical functionality such as direct LED temperature feedback, LED fault detection, internal PWM control for dimming, and short circuit protection – all on an automotive-qualified analog mixed-signal platform in an 8/16-pin package...
11/04/10 NXP GreenChip technology enables breakthrough quality in non-dimmable CFLs
NXP Semiconductors today announced the release of the UBA2211, a new generation of non-dimmable CFL driver ICs for 230V and 110V fluorescent lamps based on GreenChipTM technology. The UBA2211 offers a fully integrated CFL driver along with a current controlled preheat function, enabling more compact fluorescent lamp designs, highly efficient power conversion, and extended CFL lifetimes in the range of 12,000 to 15,000 hours...
11/02/10 NXP Semiconductors announces third quarter 2010 results
Highlights:
• Year-on-year comparable revenue growth 25% for NXP, 36% for High Performance Mixed Signal
• GAAP gross margin increased to 41.8%; non-GAAP gross margin rose to 42.8%
• GAAP operating margin increased to 10.7%; non-GAAP operating margin rose to 17.4%
Richard Clemmer, NXP Chief Executive Officer: “The third quarter represented our sixth consecutive quarter of growth and significant operational improvement, as we continue to execute on our High Performance Mixed Signal solutions strategy,”...
11/01/10 NXP’s new dual-core Cortex-M4 and M0 MCU redefines Digital Signal Control
NXP Semiconductors today announced the LPC4000 family, the world’s first asymmetrical dual-core digital signal controller architecture featuring ARM® Cortex™-M4 and Cortex-M0 processors. The LPC4000 brings the advantage of developing DSP and MCU applications within a single architecture and development environment...
10/28/10 NXP announces the first leadless package with tin-plated, solderable side pads
NXP Semiconductors today announced the availability of SOD882D, the industry’s first leadless package with solderable, tin-plated side pads. The SOD882D is a 2-pin plastic package measuring only 1mm x 0.6mm and is ideal for small and thin devices. With a height of only 0.37 mm (typical), it is also one of the flattest packages in the 1006-size
(0402 inch) and is available in various ESD protection and
switching diodes.
10/19/10 NXP LPC1100L and LPC1300L MCUs based on ARM Cortex-M Series achieve industry’s lowest 32-Bit operating power
NXP Semiconductors today unveiled its LPC1100L and LPC1300L microcontrollers, which have set new benchmarks in 32-bit active power consumption. The LPC1100L and LPC1300L series introduce a new low-power platform which combines ultra-low leakage design techniques with NXP’s optimized power-efficient libraries. In addition, the MCUs feature unique API-driven power profiles which provide users with ready-to-use power management templates.
10/14/10 NXP to develop cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management in Singapore
NXP Semiconductors today announced that it is developing a cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management, which can help address the challenge of traffic congestion in Singapore. Expected to be deployed in 2012, NXP will develop innovative technologies based on NXP’s next-generation Automotive Telematics On-board Platform (ATOP). Singapore will be a test bed for ATOP, leveraging the city’s world-class infrastructure to deliver real-time information via mobile broadband and help reduce traffic congestion.
10/11/10 NXP Introduces new energy metering chip
NXP Semiconductors today announced the EM773 energy metering IC – the world‘s first 32-bit ARM™-based solution designed specifically for non-billing electricity metering applications. In recent years, Advanced Metering Infrastructure (AMI) and smart meters have become popular with regulators and utilities as a means to introduce more sophisticated pricing models and tariffs,
and incentivize customers to adjust their energy
consumption accordingly.
10/06/10 LA Metro selects NXP's MIFARE UltralightTM technology for paper ticketing
NXP Semiconductors today announced that Los Angeles County Metropolitan Transport Authority (LA Metro) will begin circulating single and limited-use paper tickets that will use NXP MIFARE Ultralight™ contactless chip technology within its existing automatic fare collection infrastructure. With over 353 million bus boardings in 2009, this technology will allow LA Metro passengers to use smart paper tickets with the installed contactless transportation ticketing system, thereby improving customer experience while significantly lowering maintenance costs...
09/29/10 NXP wins two prestigious Global Marketing Awards
NXP Semiconductors today announced that it has won two leading industry awards for its website and online marketing activity – the 2010 WebAward for outstanding achievement in web development and MediaPost’s Online Media, Marketing & Advertising (OMMA) Member’s Choice Award for the best integrated online campaign. Both awards recognize the outstanding efforts NXP has made to help simplify the lives of busy electronic designers while also educating them about pressing industry issues...
09/27/10 Call for Entries: NXP mbed Design Challenge 2010
NXP Semiconductors has officially kicked off the NXP mbed Design Challenge 2010, in collaboration with Circuit Cellar: The Magazine for Computer Applications and Elektor International Media. Starting today, engineers from around the world are invited to use the mbed NXP LPC1768 prototyping board and mbed online "Cloud" compiler to develop an innovative hardware- or software-based application…
09/23/10 NXP Announces LDMOS UHF Transistor With DVB-T Output Power of 120W
NXP Semiconductors today announced the availability of an Ultra High Frequency (UHF) RF power transistor; the BLF888A, a 600W LDMOS device for broadcast transmitters and industrial applications. The BLF888A is the most powerful LDMOS broadcast transistor in the market to date. For a DVB-T signal over the full UHF band from 470
to 860MHz, the transistor can deliver 120W average power
with efficiencies greater than 31 percent...
09/20/10 NXP’s 150 MHz LPC1800 MCU delivers industry’s highest ARM Cortex-M3 performance
NXP today announced the availability of the industry‘s highest performance ARM® Cortex™-M3 microcontroller. The LPC1800 is optimized for low power operation at very low frequencies all the way through to 150MHz maximum performance from either Flash or RAM. This performance provides maximum connectivity and bandwidth options for a wide range of demanding applications...
09/10/10 NXP unveils world’s first satellite silicon tuner addressing requirements of both FTA and STB applications
NXP Semiconductors today announced the TDA20142 – the first satellite silicon tuner addressing the challenging requirements of both free-to-air (FTA) and operator satellite set-top box (STB) applications. The TDA20142 also reduces system cost through competitive pricing and reduced bill of materials (BoM)...
09/06/10 NXP's MIFARE Plus chosen to power the ground transportation ticketing systems in Sochi, Russia in preparation for the 2014 Winter Olympics
NXP today announced that its contactless microcontroller, MIFARE Plus™, has been chosen by the Russian city of Sochi – host of the 2014 Winter Olympics – to power the Automatic Fare Collection (AFC) system of its ground transportation network. This will be the first rollout of MIFARE Plus in Russia and the Commonwealth of Independent States...
09/02/10 NXP announces HDMI companion chip for mobile devices, providing level shifting for DDC, CEC and HPD
NXP Semiconductors today announced the availability of a new HDMI companion chip for mobile devices, which provides bidirectional level shifting between the 1.8/3.3V (range between 1.62 and 3.63V) at the host side and the 5V of the HDMI connector side for the DDC (Display Data Channel), CEC (Consumer Electronics Control) and the HPD (Hot Plug Detect). All these lines, along with the HDMI 5V supply line, also offer a high level of ESD protection according to IEC61000-4-2, level 4...
09/01/10 Next-Generation NXP system basis chips address stringent EMC requirements of global car OEMs
NXP Semiconductors today announced the release of the UJA107xA family, its next generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. Offering enhanced EMC (Electromagnetic Compatibility) performance, the chips meet the stringent requirements of global car OEMs such as Audi, BMW, Daimler, Ford, Porsche, Renault, Toyota and Volkswagen...
08/26/10 NXP IC Enables up to 98 percent efficient power extraction in Solar PV Applications
NXP today announced the availability of the MPT612 – a unique low-power IC dedicated to performing the Maximum Power Point Tracking (MPPT) function for applications using solar photovoltaic (PV) cells or fuel cells. Supported by a patent-pending MPPT algorithm, the MPT612 IC can deliver up to 98-percent efficient power extraction in applications such as solar battery charge controllers, distributed MPPT and micro-inverters...
08/19/10 NXP selected to secure new German national identity card
NXP Semiconductors today announced that its SmartMX secure contactless microcontroller chip has been chosen to power the new German contactless National Identity card (Neuer Personalausweis). The German government has selected NXP as the supplier of an inlay solution containing a dedicated SmartMX chip, packaged in an ultra-
thin module...
08/17/10 NXP Semiconductors announces second quarter 2010 results
Sales were $1,201 million in the second quarter of 2010, a comparable increase of 43.6% from the second quarter of 2009 and a comparable increase of 6.5% compared to the first quarter of 2010. The increase was visible across all business segments and regions. Income From Operations in the second quarter of 2010 was $93 million compared to a loss of $217 million in the second quarter of 2009 and breakeven in the first quarter of 2010...
08/12/10 NXP releases 2009 Sustainability Report
NXP Semiconductors announced today the publication of its Sustainability Report for 2009. The report, “High Performance Mixed Signal: Innovations for a better tomorrow,” explains how NXP products are helping to enable society as a whole to reduce energy consumption; describes the performance of NXP itself with regard to sustainability; and outlines how the company is working toward sustainable growth in the future...
view full PDF report here
08/06/10 NXP announces pricing of its initial public offering
NXP Semiconductors announced today that its initial public offering of 34,000,000 shares of common stock will be priced at $14 per share. The shares are scheduled to begin trading August 6, 2010, on the NASDAQ Global Select Market under the ticker symbol “NXPI.” The offering’s underwriters will have a 30-day option to purchase up to 5,100,000 additional shares of common stock at the initial public offering price…
