11/14/12 Audi and NXP announce strategic partnership for automotive innovation
Partnership to drive innovation speed and time to market in eight automotive electronics application segments
Audi and NXP today announced at that they have signed a strategic partnership for innovation. The partnership focuses on innovation speed and time to market in eight selected automotive electronics application segments ranging from long-established core leadership positions of NXP’s automotive business, such as in-vehicle networking and car entertainment, to emerging technologies for the connected car.
11/06/12 NXP launches next-generation smart paper ticketing IC
MIFARE Ultralight EV1 with industry’s first three independent counters enables flexible tariff schemes and multi-operator mode
NXP Semiconductors today announced the MIFARE Ultralight EV1, its next generation of contactless paper ticketing ICs. The MIFARE Ultralight EV1 is an optimized ‘smart paper’ ticket IC with unique features which enable transport operators to enjoy more flexibility in ticketing and tariff schemes, extending options for limited-use applications and ensuring more reliable system operation.
11/02/12 NXP delivers NFC to Microsoft’s Windows phone 8 devices
NXP Semiconductors announced that Microsoft’s® Windows Phone 8 operating system will integrate the software stack of NXP’s NFC controller, the PN544, enabling rich user experiences and convenient interactions for mobile users. By being pre-integrated and end-to-end validated by Microsoft, NXP’s NFC technology becomes the smart choice for handset manufacturers to deliver NFC enabled smartphones based on Windows Phone 8 quickly to market.
10/16/12 NXP achieves ultra-low output voltage ripple with 6-MHz DC/DC converter
NXP Semiconductors today announced its DC6M DC/DC switching regulator family featuring a very high 6-MHz frequency, an ultra-low output voltage ripple performance of 7 mV, and high efficiency up to 95 percent. The DC6M family supports up to 650 mA supply current in a very small wafer-level chip-scale package (WLCSP6), measuring only 1.36 x 0.96 x 0.47 mm. With an input voltage range from 2.3 to 5.5 V, the new DC/DC converters are ideally suited for battery-driven portable devices such as smartphones, as well as other consumer devices where reliable, efficient power management is essential and space is limited.
09/14/12 NXP narrows guidance range for Q3 2012
NXP announced today it narrowed its guidance range for the third quarter of 2012. NXP currently anticipates that product revenue growth will be in a range of 8-to-10 percent sequentially. Additionally, total NXP revenue growth is expected to be in a range of approximately 6-to-8 percent. The company further anticipates that non-GAAP EPS will be in a range $0.53-to-$0.59. No other changes to the previously provided guidance of July 24, 2012 are contemplated in this update.
07/24/12 NXP reports Q2 2012 results
Operational results ahead of expectations
NXP Semiconductors today reported financial results for the second quarter of 2012 and provided guidance for the third quarter 2012. “We are very pleased with our performance during the second quarter of 2012 as we delivered revenue of $1,094 million, which was above the upper end of our guidance range. We experienced growth in every one of our target end markets, notwithstanding the uncertain macro environment we find ourselves operating within, said Richard Clemmer, NXP Chief Executive Officer.
07/04/12 NXP enables next-generation urban mobility
NXP today announced it has begun testing a next-generation congestion management system in Singapore. Cars equipped with NXP’s 3.5G telematics solution ATOP (automotive telematics on-board unit platform) are currently piloting this urban modern mobility solution. Singapore’s world-class infrastructure is the ideal test bed for intelligent traffic solutions as it faces the mobility challenges of today’s global megacities and aims to reduce pollution and congestion. During the Singapore trial, cars equipped with ATOP - a module allowing for cost-efficient and flexible integration into automotive electronics - will wirelessly collect real-time traffic data via 3.5G mobile broadband.
06/26/12 NXP launches dual magnetic sensor for safety-critical car engine throttle applications
NXP today announced the KMA220, a dual magnetic sensor designed for all automotive applications where a mechanical angle needs to be measured. Integrating two sensor systems in a single package, it is particularly relevant for throttle control applications where a redundant system solution is required. Operating in a simple disk magnet configuration with no need for a PCB or external components, the KMA220 offers a unique solution to the automotive market.
06/08/12 NXP announces GreenChip for low-cost LED lamps up to 10W
NXP today announced the SSL2115x series of high-efficiency GreenChip™ driver ICs for low-cost LED retrofit lamps. The newSSL21151 and SSL21153 are designed for non-dimmable 5W and 10W LED lamps respectively, providing good current control in flyback and buck-boost configurations. The SSL2115x enables small form-factor LED drivers, using primary-side sensing to regulate current, and offering integrated LED open/short protections, an internal 700V MOSFET, and a circuit enabling start-up directly from the rectified mains voltage. With the use of an additional valley fill circuit, the SSL2115x series can offer a power factor of approximately 0.9.
05/15/12 NXP Powers NFC in Samsung GALAXY S III
NXP has announced that its PN65 Mobile Transactions solution will power the Samsung GALAXY S III bringing a new concept of human-centric mobile experience. The highly anticipated Samsung GALAXY S III is the successor of the Samsung GALAXY S II. The Samsung GALAXY S III will incorporated a 4.8 inch display, a 8MP camera and a quad-core processor. Powered by Google’s Android™ 4.0 Ice Cream Sandwich operating system, the GALAXY S III supports secure NFC applications, such as wallets being launched by mobile network operators, card associations and other such as Google’s Wallet.
04/27/12 NXP reports first quarter 2012 results
Revenue $978 million
GAAP Gross margin 43.4%
GAAP Operating margin
5.6% GAAP Earnings/(Loss) per share ($0.10) Non-GAAP Gross margin 44.3%
Non-GAAP Operating margin 14.4%
Non-GAAP Earnings per share $0.19
NXP Semiconductors today reported financial results for the first quarter of 2012 and provided guidance for the second quarter 2012. Richard Clemmer, NXP Chief Executive Officer. “We are pleased with our performance in the first quarter of 2012 as we delivered revenue of $978 million, which was near the upper end of our original guidance range.
04/02/12 RFID chipmakers align on industry-wide serialization schema
NXP Semiconductors today announced industry alignment on a chip-based serialization schema, termed MCS (Multi-vendor Chip-Based Serialization), to facilitate serialization for brand-owners using passive RFID tags for item level tagging. MCS is designed to address applications using the Serialized Global Trade Identification (SGTIN-96) for universally identifying products in the supply chain and complies with the guidelines set forth by GS1, the standards body for Electronic Product Code (EPC). Aligned UHF EPC Gen2 RFID tag IC manufacturers include Alien Technology®, Impinj® and NXP Semiconductors.
03/29/12 NXP appoints industry veteran to lead microcontroller business
NXP today announced that it has appointed Jim Trent as vice president and general manager of its microcontroller business line. Jim will be based in San Jose, California, and will lead NXP’s microcontroller business worldwide, reporting to Alexander Everke. “Over the past 15 years, the microcontroller business at NXP has had remarkable growth, as we’ve transformed our business to focus on the 32-bit ARM platform,” said Alexander Everke, executive vice president of the High Performance Mixed Signal business unit, NXP Semiconductors.
02/10/12 NXP reports Q4 and 2011 full year results
swings to loss in Q4, optimistic on Q1
NXP has reported a $182 million net loss on revenues of $931 million in the fourth quarter of 2011. The loss contrasted with a net profit of $301 million in 3Q11 and was larger than the net loss of $118 million reported for 4Q10. Revenue was down 12.2 percent from $1.06 billion in 3Q11 and down 13.6 percent from $1.078 billion in 4Q10, but product revenue, at $857 million, was roughly at the mid-point of original guidance given in November 2011. For the full year of 2011 NXP reported a net profit of $390 million on revenues of $4.194 billion.
02/02/12 NXP announces new benchmark in miniaturization
NXP today announced to have set a new benchmark in miniaturization with the launch of its next-generation family of low VF Schottky rectifiers, targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new plastic package is the smallest on the market that is capable of carrying a current of up to 1.5A. Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors, said: “These devices are a real breakthrough in terms of both miniaturization and current density for mobile device designers, giving them functionality options not previously available at this size.
01/13/12 NXP demonstrates solar-powered street lighting solution
NXP today announced that it has developed an innovative, sustainable and highly efficient solar-powered street lighting solution, together with Philips Lighting. The groundbreaking Solar Gen2 solution, which NXP is demonstrating this week at CES 2012, could have a major impact on energy consumption in urban areas at night. By charging street lamps during daylight hours, the new solar-powered solution from Philips Lighting and NXP can supplement the capacity of the conventional electricity grid, saving money and reducing CO2 emissions.
01/09/12 NXP launches ultra-compact, high-precision MEMS frequency synthesizer
NXP today unveiled its ultra-compact, high-precision MEMS-based frequency synthesizer, which presents a compelling alternative to quartz crystal-based timing devices. NXP’s MEMS technology replaces a quartz crystal with a bare silicon die that is more than 20 times smaller than the smallest crystal available today. The MEMS die does not require any dedicated, quartz-like, ceramic or metal-can hermetic package. Instead, it can be merged with other IC’s into a standardized, low-cost plastic package.
01/05/12 Treehouse Labs and NXP unveil BiKN technology platform
Seeking to revolutionize the way mobile networks and applications for control, tracking and monitoring are delivered, Treehouse Labs today unveiled the BiKN™ Technology Platform. The Platform uses low-power wireless chip technology from NXP to enable the “Internet of Things,” opening entirely new markets and applications for affordable wireless sensor and control networks. The thesis behind the BiKN Technology Platform is three-fold: Integrate hardware and software; operate through mobile and web-enabled devices; and leverage a patented advantage by using IEEE802.15.4 low-power networking standards enabling rapid creation and scalability of sensor and remote control networks while reducing current development costs.
12/05/11 NXP ships world’s fastest ARM Cortex-M4 and Cortex-M3 microcontrollers
NXP Semiconductors today announced the availability of the LPC4300 Digital Signal Controller (DSC) – at 204 MHz, the world’s fastest ARM® Cortex™-M4 processor. The LPC4300 is the industry’s first asymmetrical dual-core DSC with a Cortex-M0 co-processor. Also today, NXP announced that it has increased the performance of its LPC1800 series to 180 MHz, extending its lead as the world’s fastest Cortex-M3-based microcontroller. Designed in parallel, the LPC4300 and LPC1800 have been manufactured using the same ultra-low leakage 90-nm technology, are pin- and software-compatible, and share many key features.
11/21/11 NXP launches industry’s first medium power transistors in 2x2-mm leadless DFN package
NXP Semiconductors today announced the industry’s first medium power transistors in a 2-mm x 2-mm 3-pin leadless DFN package. Offering a unique solution in an ultra-small DFN2020-3 (SOT1061) Surface-Mounted Device (SMD) plastic package, the BC69PA transistor is the first in a family of medium power transistors from NXP available in a miniature form factor. Ideally suited for general-purpose power-sensitive applications in mobile, automotive, industrial and household appliances, the new DFN2020-3 (SOT1061) packaging can save up to 80 percent more space on the PCB compared to conventional SOT89 packages, while maintaining high electrical performance of up to 2 Amps.
11/02/11 NXP’s NFC solution implemented in Google’s Galaxy Nexus
NXP Semiconductors today announced that the recently launched Galaxy Nexus™ from Google™ incorporates NXP’s fully integrated near field communication (NFC) solution PN65N. Featuring a NFC radio controller and an embedded Secure Element, the PN65N is also fully validated and integrated on the latest release of Android™ 4.0, also refered to as Ice Cream Sandwich. The availability of NXP's
open-source NFC software on Ice Cream Sandwich enables
mobile phone and now also tablet manufacturers to quickly
and easily design NFC-enabled, Android-based mobile devices.
11/01/11 NXP reports Q3 2011 Results
NXP Semiconductors today reported financial results for the third quarter 2011, ended October 2, 2011, and provided guidance for the fourth quarter 2011. Product Revenue from continuing operations was $970 million, an increase of 3.6 percent from the $936 million of Q3 2010, and a decrease of 5.4 percent from the $1,025 million reported in Q2 of 2011. Total revenue from continuing operations was $1,060 million, a decrease of 5.4 percent from the $1,120 million of Q3 2010 and a decrease of 5.4 percent from the $1,121 million in Q2 of 2011. “During the third quarter NXP delivered revenue around the lower end of our original guidance, as customer order-rates slowed in response to the uncertain macro-economic environment,” said Richard Clemmer, NXP Chief Executive Officer."
09/26/11 NXP unveils industry’s first Cortex-M0 microcontrollers with integrated segment LCD drivers
NXP Semiconductors today introduced the LPC11D00 and LPC12D00 series of microcontrollers – the first ARM® Cortex™-M0 microcontrollers with integrated segment LCD drivers, enabling high contrast and brightness in a single chip. Featuring the NXP PCF8576D LCD driver, the LPC11D00 and LPC12D00 are capable of driving any static or multiplexed Liquid Crystal Displays containing up to 4 backplanes and 40 segments, and can be easily cascaded with multiple segment LCD drivers to accommodate up to 2560 segments for larger display applications...
09/19/11 NXP enhances NFC tag IC portfolio
improved sensitivity enables smaller tags, higher read range
NXP today introduced the NTAG203 NFC Forum-compliant Type 2 tag, the newest family of integrated circuits to enhance the deployment of NFC tags for OEMs, inlaycustomers and end users. As customer interest in NFC continues to grow, NXP has responded with the NTAG2 family of NFC tag solutions to effectively deploy NFC in emerging use cases. Applications such as smart posters, social media, service discovery, and electronic enhancement of printed media can all leverage the simplicity of a tap of the NTAG203-based tag to seamlessly retrieve data...
09/13/11 NXP introduces USB 3.0 SuperSpeed redriver
PTN36241B supports 5Gbps per channel with richest feature set in the market
NXP Semiconductors today announced the release of a breakthrough USB3.0 SuperSpeed redriver, the PTN36241B – a dual-channel device that supports 5 Gbps per channel with optional settings that provide a high level of extendability. As computing systems become faster, signal integrity tends to deteriorate more rapidly than in slower systems. The PTN36241B redriver provides signal equalization on a weakened signal, followed by transmit de-emphasis, thus maximizing link performance, enhancing signal integrity and improving system reliability...
08/23/11 NXP delivers world's first no-offset I2C-bus buffers
Unique bus buffers drive I2C-bus signals over long distances, interface with other bus buffers
NXP today introduced the PCA9525 and PCA9605 – the industry’s first no-offset I2C-bus buffers, which enable system designers to isolate capacitance and interface with other bus buffers. These groundbreaking bus buffers use the no-offset scoreboard method to decide signal direction, rather than using a directional pin and relying on offset voltages to control direction and prevent bus latch-up. Significantly, the no-offset devices are interoperable even with static offset or incremental bus buffers, allowing easy design-in regardless of which other devices are on the bus..
08/18/11 NXP introduces partial networking solution for vehicles
Milestone in CO2 reduction and energy efficiency
As governments around the world call for a reduction in CO2 emissions from vehicles, auto manufacturers are increasingly focused on finding ways to produce more environmentally-friendly vehicles. As such, car manufacturers are now pushing for CAN Partial Networking – a major innovation in power efficiency - to become an industry standard via ISO and AUTOSAR. NXP Semiconductors today announced the first NWP ISO 11898-6 and AUTOSAR R3.2.1 compliant solution supporting CAN Partial Networking. The stand-alone TJA1145 CAN transceiver and system basis chip UJA1168 – the world’s first highly integrated solution to support CAN Partial Networking – give design engineers precision control over a vehicle’s bus communication network...
08/11/11 NXP drives miniaturization with ultra-compact power management solution for portable devices
Combined two-in-one Low VCEsat Transistor and Trench MOSFET comes in 2x2 mm leadless package
NXP Semiconductors today announced the PBSM5240PF, an ultra-compact Medium Power transistor and N-channel Trench MOSFET housed in a leadless DFN2020-6 (SOT1118) plastic package. Measuring only 2 x 2 mm and with a height of just 0.65 mm, the DFN2020-6 (SOT1118) has been designed in response to the industry trend for miniaturization in high-performance consumer products such as mobile devices. As one of the first power management solutions on the market to integrate a low VCE(sat) BISS transistor and Trench MOSFET into a 2-in-1 product, the PBSM5240PF saves space on the PCB, while delivering high electrical performance...
07/29/11 NXP Semiconductors Reports Second Quarter 2011 Results
NXP today reported financial results for the second quarter 2011 and provided guidance for the third quarter 2011. “NXP delivered revenue growth during the second quarter at the high end of our original guidance with all of our business lines delivering sequential revenue growth,” said Richard Clemmer, NXP Chief Executive Officer. “Our quarterly performance marks the ninth consecutive quarter of sequential product revenue growth, a demonstration of the continued customer adoption of our overall product portfolio...
07/28/11 New generation of position sensors improves performance of automotive applications
NXP Semiconductors today announced the release of a new generation of automotive position sensors, KMA210. The KMA210 incorporates NXP’s latest magnetoresistive sensor chip and a unique signal conditioning ASIC developed in NXP’s advanced Silicon on Insulator (SOI) ABCD9 process technology. It is the first of a new magnetic sensor family in a full system-in-package solution that requires no external components. KMA210 is specially designed to improve the overall performance and increase robustness in automotive applications...
07/20/11 NXP Introduces Transmission Line ESD Protection for HDMI Transmitters
IP4786 is industry’s only complete HDMI 1.4 signal-conditioning and protection IC
NXP Semiconductors today announced the IP4786CZ32, a highly integrated HDMI signal-conditioning IC which provides the industry’s highest levels of protection for HDMI 1.4 transmitter applications. Featuring a unique Transmission Line Clamping architecture that provides lower peak clamping voltages during an ESD strike, the IP4786 delivers strong ESD protection, the best signal integrity and the highest level of integration available in the industry today...
06/22/11 NXP unlocks the potential of multifunction car keys
Pioneering the market for ‘smart’ car keys, NXP Semiconductors today announced the availability of its production-ready single-chip solution for multifunction car keys - the NCF2970 (KEyLink Lite). Enhancing the functionality of car keys by supporting Near Field Communications (NFC) technology, NXP’s KEyLink Lite enables car manufacturers to offer a new driving experience with keys that connect to external NFC-compliant devices, such as mobile phones, tablets and laptops. The launch of KEyLink Lite is timed to take advantage of the growing popularity and availability of NFC. Drivers will be able to simply wave their car key over an NFC-compliant mobile device to access essential and useful car data...
06/16/11 Sony Ericsson selects NXP’s NFC solution for its Android-based Smartphone
Today NXP Semiconductors announced that its near field communication (NFC) technology has been selected by Sony Ericsson for inclusion in its Android-based smartphones. Sony Ericsson will use NFC to further enhance its consumers’ mobile experiences, creating a portfolio of smartphones that enable mobile transactions. Using simple touch gestures, consumers will be able to
make purchases or connect to a point of sale (POS) terminal,
ticketing terminal or location-based promotional tag simply
and securely with their NFC-enabled smartphones...
06/14/11 NXP small-signal MOSFET’s set new benchmark in RDS(on)
New portfolio enables increased power efficiency for mobile computing, communications and other consumer applications
NXP Semiconductors today announced a new family of small-signal MOSFETs delivering breakthrough low RDS(on) performance. The low RDS(on) P-Channel and N-Channel MOSFETs enable lower power consumption for consumer electronics applications such as notebooks, tablets, handsets, e-readers, set-top-boxes and LCD TVs. These high-efficiency MOSFETs are available in high-volume SOT23 and SOT457 packages with a compact 3-mm x 3-mm footprint, allowing design engineers to replace larger package types with significantly smaller solutions offering similar or better on-resistance...
06/08/11 NXP introduces eXtremely rugged XR LDMOS RF power transistors
New XR family offers best-in-class ruggedness and performance without added cost
Designed for the toughest engineering environments, NXP Semiconductors today unveiled its new XR family of “eXtremely Rugged” LDMOS RF power transistors. The XR
family is designed tough-as-nails to withstand the harsh fault
conditions often found in applications such as industrial lasers,
metal etching and concrete drilling. Based on NXP’s industry-
leading LDMOS technology, the XR family extends LDMOS into
the few remaining domains that are serviced by VDMOS and
bipolar transistors today...
06/01/11 NXP’s NFC partner program debuts in China and Taiwan
NXP installs a unique ecosystem to enable NFC adoption across devices and applications
NXP Semiconductors today announced the launch of the first near field communication (NFC) Partner Program to support mobile phone and consumer device manufacturers wanting to integrate NFC into upcoming designs in China and Taiwan. Since the co-creation of the NFC standard and the NFC Forum, NXP has been at the forefront of developing this market by bringing all industry partners together. Starting at the heart of the creation of the ISO standards, NXP has continuously contributed to the industry with a distinctive blend of market-making alliances and unrivalled technical excellence. The mobile transactions market has evolved into a rich ecosystem with very diverse applications demanding a complete portfolio of solutions...
05/31/11 NXP announces availability of LPC1788
120-MHz ARM Cortex-M3 MCU also features Ethernet, USB and External Memory Controller
NXP Semiconductors today announced availability of its LPC1788 microcontroller – the industry’s first ARM® Cortex™-M3-based MCU to be shipping in volume with an
integrated LCD controller. With up to 96 KB of on-chip SRAM
and a 32-bit external memory interface, the LPC178x series
allows customers to easily and cost-effectively add high-quality
graphics to their applications. With support for a wide range of
graphics display panels, the LPC178x series is ideal for industrial
automation, point-of-sale, and medical diagnostic applications...
05/27/11 NFC Enables Secure Mobile Transactions for Google Wallet
Today NXP Semiconductors announced that its world leading near field communication (NFC) technology enables the newly announced Google Wallet. NXP joins partners Google, Citibank, MasterCard, First Data, and Sprint, along with other market leaders, in New York to unveil Google Wallet, an open platform enabling mobile transactions. With NXP’s secure contactless NFC solution, consumers can simply wave their phones over intelligent surfaces to pay for goods, apply a discount coupon, or receive loyalty points. Google Wallet allows consumers to replace a multitude of physical cards typically carried in wallets with a NFC enabled phone delivering convenience, personal interactivity and security for many different types of transactions...
05/17/11 NXP demonstrates new car-to-x communication platform
Major milestone towards safer road traffic
NXP Semiconductors this week gave a live demonstration of car-to-x (C2X) communication on a public road in the Netherlands. With this demo, NXP is the first semiconductor
company to take the step from showing concepts to actually
demonstrating an automotive-ready hardware platform for
connected mobility. NXP has co-developed the C2X platform
with Australian-based Cohda Wireless. Combined with
telematics for location-based services and networking
security, the platform enables the fully connected car
and is therefore a major milestone towards mass
deployment for safer road traffic...
05/16/11 An internet address for every light bulb
NXP’s GreenChip smart lighting solution opens an entirely new dimension in energy efficient lighting
What if every light bulb had its own unique Internet IP address? The possibilities are endless: You could monitor, manage and control every light bulb from any Internet-enabled device – turning lights on and off individually, dimming or creating scenes from your smartphone, tablet, PC or TV – to save energy as well as electricity costs. Your “smart lighting” network could have dozens or even hundreds of appliances connected through a wireless network designed for maximum energy savings, communicating information about their environment, about power consumption levels, and alerting you to any problems. Today, NXP is introducing its GreenChip™ smart lighting solution that makes the Internet-enabled, energy-efficient lighting network a reality – not only for businesses, but also for consumers trying to make the most of energy savings in the home...
05/11/11 MIFARE4Mobile Industry Group Announces Roadmap
The MIFARE4Mobile Industry Group, consisting of leading players in the Near Field Communication (NFC) ecosystem including Ericsson, Gemalto, Giesecke & Devrient, NXP Semiconductors, Oberthur Technologies, STMicroelectronics and ViVOtech, today announced the new roadmap for MIFARE4Mobile™ specifications. The companies are collaborating to integrate support for the following new features and technologies in the next version 2.0 of the MIFARE4Mobile specifications..
05/04/11 NXP Semiconductors reports first quarter 2011 results
Product Revenue from continuing operations of $979 million, up 4.4 percent sequentially
GAAP Gross margin 46.8%
GAAP Operating margin 10.0%
GAAP Earnings per share $0.73
Non-GAAP Gross margin 47.8%
Non-GAAP Operating margin 20.6%
Non-GAAP Earnings per share $0.46
“NXP delivered better than anticipated top-line revenue during the first quarter as nearly all of our focus segments out-performed our original expectations,” said Richard Clemmer, NXP Chief Executive Officer. “Our quarterly performance successfully demonstrates NXP's strategy to focus on the faster growing High Performance Mixed Signal market, and to opportunistically service the broad-based Standard Products market...
05/03/11 NXP announces the world’s highest performance RF Digital-to-Analog Converter
Significant circuit innovations enable linearity performance breakthroughs
NXP Semiconductors today announced the DAC1627D – a 16-bit dual-channel LVDS DDR interface Digital-to-Analog Converter (DAC) which supports output update rates of up to 1.25 Gsps. In terms of dynamic performance specifications, this new high-speed DAC offers best-in-class single tone SFDR performance and two-tone intermodulation distortion over a broad output bandwidth of 200 MHz...
04/27/11 NXP announces CGVxpress High Speed Serial Interface
New CGVxpress extends high speed serial interface leadership providing higher bandwidth, deterministic latency and harmonic clocking for WIFR, ISM and A&D applications
NXP Semiconductors today announced CGVxpress™, an important extension to its high speed data converter technology portfolio and the next generation of the CGV™ high speed serial interface announced in 2009. The newly announced CGVxpress will be used in future NXP ADC and DAC product families. The first demonstration of CGVxpress will occur at booth #420 of the IEEE International Microwave Symposium (MTT-S) held June 7-9, 2011 in Baltimore, Maryland. NXP will showcase a 4.5 Gbps CGVxpress transmitter interworking with an industry standard FPGA over a 20 cm differential data lane...
04/21/11 NXP “Anubhav” University program launches “Automotive Center Of Excellence” at I 2 IT
New Automotive Centre of Excellence founded in Pune to foster automotive research and product development
NXP Semiconductors today inaugurated the Automotive Centre of Excellence (ACE) in Pune in association with the International Institute of Information Technology (I 2 IT). Located at I 2 IT Pune Campus,this Center of Excellence will provide unique infrastructure and collaboration of the industry and academia. The center will foster the innovation in the field of automotive electronics and would provide students, faculties, automotive Original Equipment Manufacturers (OEMs), automotive sub-assembly suppliers and industries in the region with expert technical support for product development and research activities to address market demands. In January 2011, NXP had announced an elaborate initiative called NXP ‘Anubhav’ to set up state-of-the-art labs at top engineering institutes in India and the Automotive Center of Excellence is a step in the direction...
04/18/11 NXP and Poken to join forces to develop NFC products for social networking
Poken SA announced its collaboration with NXP Semiconductors at WIMA 2011, Poken will launch the first end-to-end NFC compliant platform for social networking, extending the benefits and productivity enhancements of existing social media tools to the real world. The new platform adds to Poken’s product portfolio by adding NFC-based loyalty, payment, and access control capabilities to an already-successful range of social media products...
04/16/11 NXP Ships 500 Millionth ABS Sensor Module
Continental ABS wheel speed sensors feature MR speed sensor modules from NXP
NXP Semiconductors today announced that it has shipped more than half a billion ABS speed sensor modules – a key milestone in NXP’s relationship with Continental, one of the leading global automotive suppliers. The Chassis & Safety
Division of Continental has worked closely with NXP to develop
advanced ABS/ESC sensor modules that are now used by most
car manufacturers in the world, in both the standard and high-end
segments of the market...
04/04/11 NXP aids “No Sponge Left Behind” in surgical procedures
RFID-based SmartSponge System helps prevent retained foreign objects in surgical patients
NXP Semiconductors announced that ClearCount Medical Solutions has selected NXP RFID solutions to enable its SmartSponge® System. The SmartSponge System can easily and accurately detect and account for surgical sponges placed in a patient’s body when undergoing surgery, so that no items are “left behind,” thus improving patient safety. The SmartSponge System is comprised of RFID-enabled surgical sponges; an embedded RFID reader within a user-friendly automated software accounting system; an accompanying SmartWand to detect sponges accidently retained within the body; and a smart disposal system to account for discarded sponges...
03/29/11 NXP releases world’s smallest logic packages for handheld mobility
6- and 8-pin plastic leadless packages up to 60 percent smaller with improved mechanical performance and robustness
NXP today announced the world’s smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch. The ultra-compact packaging design is ideal for leading-edge
portable handheld devices such as smartphones, tablets and SD
cards where chip and board space comes at a premium.
The SOT1115 package decreases package size by 10 percent for
the 6-pin version compared to the previous smallest package,
SOT891, of which NXP has produced over one billion units...
03/23/11 NXP releases LIN transceiver with integrated voltage regulator in compact package
TJA1028 enables robust nodes in LIN bus systems
NXP today announced the TJA1028, a LIN transceiver family with an integrated low-drop voltage regulator in a very small 3x3mm leadless package. The voltage regulator is designed to power an automotive Electronic Control Unit (ECU), integrating the major peripheral functions around the microcontroller of a typical LIN-networked ECU into a single chip. The combination of voltage regulator and bus transceiver makes it possible to develop compact yet powerful slave nodes in LIN bus systems...
03/08/11 NXP builds a smarter way to energy efficiency with world's lowest standby power
Highly efficient family of GreenChip low-power adapters saves money and energy
NXP today announced a new generation of GreenChip™ power solutions which feature the lowest standby capability in the industry, reaching levels below 10mW.
The NXP GreenChip power ICs, also known as Switch Mode
Power Supply controller ICs, are designed for adapters for
mobile devices such as cell phone chargers, tablets and
notebooks, as well as major home appliances or white goods...
02/28/11 NXP and ARM extend strategic licensing agreement for microcontrollers
NXP Semiconductors and ARM today announced that they have expanded their strategic relationship with a long-term subscription licensing agreement around the ARM® Cortex™-M series processors for microcontrollers. Under the agreement, NXP will also be working with ARM in developing and expanding its future microcontroller roadmap in areas including performance and energy efficiency...
02/22/11 NXP expands ARM Cortex-M0 microcontroller portfolio with LPC1200 Industrial Control Series
Over 50 Flash and SRAM size options with configurable peripherals optimized for energy-efficient controls and appliances
NXP today announced its LPC1200 Industrial Control Series featuring the ARM® Cortex™-M0 processor. The LPC1200 extends NXP’s 32-bit ARM microcontroller continuum and
targets a wide range of industrial applications in the areas
of factory and home automation, such as white goods,
motor control, power conversion and power supplies.
It also expands NXP’s Cortex-M0 microcontroller offering
with a wide range of Flash memory sizes.
02/14/11 NXP brings smart card security to device authentication
Secure au10tic microcontrollers feature banking-grade security technology to combat counterfeit devices
NXP today announced the au10tic™ family of secure ICs designed specifically for device authentication. The au10tic secure microcontrollers are based on NXP's proven security technology, which has been widely used for securing government ID cards and passports, as well as smart cards for banking and other high-security applications. Offering easy integration into end devices, the NXP au10tic ICs provide a complete tamper-resistant security solution including key generation and programming services, as well as the option for remote management of applications and credentials running on the secure MCU...
02/11/11 Oberthur and NXP announce licensing agreement for MIFARE on SIM card
Agreement aims to boost NFC payment and ticketing services
NXP and Oberthur Technologies, announced today a licensing agreement for NXP’s MIFARE™ technology. This agreement enables Oberthur Technologies to integrate MIFARE™ into its SIM cards globally. This will further drive the adoption of NFC-enabled phones in infrastructures such as public transit, event ticketing, customer loyalty programs and access control around the globe. Under this agreement, Oberthur Technologies will expand its existing UICC product portfolio adding MIFARE DESFire™ and MIFARE Plus™ technology...
01/27/11 Atos Origin and NXP introduce end-to-end security in the smart grid
Atos Worldline and NXP today announced a unique end-to-end security and authentication solution designed to protect Smart Grid networks against energy theft, privacy breaches and grid attacks. The solution brings Atos Worldline’s ESS (Energy Security Service) and Atos Worldline’s SMP (Smart Meter Personalisation) together with secure last-mile devices and authentication technology from NXP...
01/24/11 NXP launches Android application
NXP Semiconductors today introduced the NXP Android application, allowing easy and fast access to NXP’s complete product portfolio. The free mobile application allows engineers to search, buy and share information on over 10,000 products from NXP’s High Performance Mixed Signal and Standard Products portfolio anytime, anywhere...