10/27/11 Besi announces Q3 2011 results
Besi today announced its results for the third quarter of 2011. Besi reports results exceed expectations, order strength in advanced packaging applications and gross margin development highlight strategic progress. Richard W. Blickman, President and Chief Executive Officer of Besi, commented: “We are pleased to report that our third quarter revenue, gross margins and net income met or exceeded our expectations … The current industry slowdown continues with only limited visibility available. Based on our current backlog and customer feedback, we expect that our revenue will decline by approximately 8-12% in Q4-11 vs. Q3-11 and that we’ll remain profitable ... Nevertheless, we will reduce our headcount by approximately 12% over the next 12 months to reduce our cost structure by approximately € 8.5 million in recognition of current market realities.”
10/03/11 Besi announces supervisory board change
BE Semiconductor Industries announced today that Mr Kin Wah Loh will resign as a member of Besi’s Supervisory Board as per the next Annual General Meeting of Shareholders in 2012. Mr Loh will resign his Besi Supervisory Board position in connection with his recent appointment as a member of NXP’s management team and as executive vice president, sales & marketing of NXP Semiconductors N.V. Mr Loh was appointed to the Supervisory Board in May 2009. Besi’s intention is to recruit a new Supervisory Board Director to replace Mr Loh at the next Annual General Meeting of Shareholders...
07/28/11 Besi Q2-11 revenue and profit meet expectations
Record H1 revenue and net Income
Richard W. Blickman, President and Chief Executive Officer of Besi: “We are pleased to report that our second quarter revenue and net income met our expectations. Our revenue was roughly equal to Q1-11 as we experienced sales growth of multi chip and flip chip die bonders for more advanced packaging applications which offset decreased shipments of certain single chip die bonders for more mainstream package types. Our net income benefitted from gross margins at the high end of guidance due to a more favorable percentage of advanced packaging systems in our sales mix and lower interest expense due to the redemption of our 5.5% Convertible Notes...
04/28/11 Besi Q1-11 Revenue and Profit Exceed Expectations
Orders Increase 54% vs. Q4-10
Key Highlights:
• Q1-11 revenue € 91.1 million is 9% above prior guidance (€ 83.5 million)
• 54% sequential order increase confirms improved order outlook
• Gross margin (40.0%) at high end of guidance (38.5-40.5%)
• Net income of € 9.6 million in Q1-11 vs. net loss of € 2.6 million in Q1-10
• Sequential net income down by € 9.8
Richard W. Blickman, President and Chief Executive Officer of Besi, commented: "We are pleased to report better than anticipated first quarter results. Q1-11 revenue and net income increased by € 34.5 million (61%) and € 12.2 million, respectively, as compared to the first quarter of 2010. As expected, this quarter’s revenue and operating profit were lower than Q4-10 but exceeded prior guidance due to higher than anticipated demand by Asian subcontractors for our assembly equipment, particularly leading edge flip chip, die bonding and die sorting systems...
02/24/11 Besi reports record 2010 results,Q4 2010 exceeds expectations
Key Highlights:
• Record 2010 revenue of € 351.1 million more than double € 147.9 million revenue in 2009
• Record net income of € 47.3 million in 2010 vs. € 5.4 million in 2009
• Besi business and financial transformation continues
• Dividend proposal of € 0.20 per share, payable either in cash or in shares
Richard W. Blickman, President and Chief Executive Officer of Besi, commented: “2010 marked the most successful year in our history as a public company. Our ability to scale our business with an expanded portfolio of advanced packaging systems in the most recent industry upturn combined with our ongoing cost reduction efforts resulted in record revenue and net income of € 351.1 million and € 47.3 million, respectively...
12/01/10 BESI announces strengthening of Management Team
BE Semiconductor Industries today announced the hiring of Berthold Butzmann as Chief Operating Officer and Guido Slump as Senior Vice President-Packaging Products. Mr Butzmann (49) will be designated Chief Operating Officer effective April 2011 and will be based at the Company’s facilities in Kuala Lumpur, Malaysia...
10/28/10 BESI reports continued revenue and profit growth in Q3-2010
Highlights:
• Q3-10 revenue growth of 12.4% within guidance. Gross margins of 40.1% exceed prior guidance
• Net income of € 15.0 million in Q3-10 vs. € 15.4 million in Q2-10 and € 11.0 million on an adjusted basis
• Cash increases by € 6.9 million vs. Q2-10 to € 55.0 million
• Orders down 34.1% vs. Q2-10 consistent with industry trends as semiconductor capacity expansion slows
07/27/10 Besi reposrts record quarterly orders and backlog. Revenue and profitability exceed expectations
Besi today announced its results for the second quarter, ended June 30, 2010. Richard W. Blickman, President and Chief Executive Officer of Besi, commented: "We are pleased to report that Besi returned to profitability in the second quarter of 2010. Shipment and order levels increased significantly due to the continued expansion of industry demand for memory, personal computing and smart phone devices and our ability to ramp production at our global facilities more rapidly than anticipated...
view full PDF report here [200 KB]
07/15/10 Besi announces preliminary revenue, orders and backlog for Q2-2010 [20 KB]
Besi today announced preliminary revenue of € 89 million in its second quarter ended June 30, 2010, an increase of € 32 million, or 56%, as compared to the first quarter ended March 31, 2010. Prior revenue guidance for the second quarter was € 79 - € 82 million. Orders for the second quarter ended June 30, 2010 of € 133 million increased by approximately € 36 million, or 37%, as compared to the first quarter ended March 31, 2010...
view full PDF report here [20 KB]
05/20/10 Meco’s metallization line for crystalline solar cells boost cell efficiencies
Meco (member of the Besi group) equipment engineers have developed their Cell Plating Line (CPL) for the metallization of crystalline solar cells to enable a fine line and thin seed layer of silver paste to boost cell efficiencies for volume production applications...
04/28/10 BESI reports first quarter revenue and profitability exceed expectations [173 KB]
view full PDF report here [173 KB]
