01/18/12 ASML Q4 2011 and full year results
Record 2011 sales and sees continued strength in H1 2012
11/30/11 Tokyo Electron Limited and ASML announce agreement to accelerate joint development activities on EUV and Advanced Lithography Technologies
Tokyo Electron Limited (TEL) and ASML today announced an agreement to accelerate joint development activities of EUV (Extreme Ultraviolet) and ArF Immersion using state-of-the-art lithography clusters. This agreement on joint development acceleration was made in order to meet increasing customers' demand for leading edge systems capable of next generation chip production, namely EUV technology, which is the key lithography solution for 22nm and beyond, and extended ArF immersion, which remains a mainstream technology for critical layers of advanced chip production. Through this dual technology leadership strategy, TEL and ASML are aiming to strengthen our offerings to best support our customers for sub 20nm nodes development.
10/28/11 Network Effects: ASML and its suppliers
Drawing on the strength of its supplier network, ASML is shifting some development work towards suppliers. This allows ASML's engineers to focus on the company's core technology. Watch this video to see how two of ASML's suppliers, VDL ETG and Prodrive, are taking on more responsibility for the design and manufacturing of certain components.
10/12/11 ASML announces Q3 2011 Results
*Q3 bookings (excluding EUV) came in just above guidance at EUR 514 million
*On track for record 2011 net sales of about EUR 5.5 billion
Outlook
*Q4 2011 bookings expected at a level above Q3.
“Despite the current turbulent macro-economic environment, ASML’s strong business model and the industry need for the latest lithography technologies enable us to reiterate our expectation of 2011 revenues of about EUR 5.5 billion, including EUV, in line with initial guidance. It is too early to understand how overall demand for semiconductors will contribute to our business in 2012".
09/19/11 ASML Brion announces a new mask correction capability to enable larger process windows for advanced 2x nm designs
Brion Technologies, a division of ASML, today announced a new product for its popular Tachyon computational lithography platform. Tachyon MB-SRAF (Model-Based Sub-Resolution Assist Features) enables the high-speed, full-chip processing of advanced chip designs with larger process windows, greater productivity, and lower development costs than rule-based alternatives. As chip geometries shrink to ever-smaller sizes the ability to image the design properly depends on resolution enhancement techniques (RET) such as sub-resolution assist features which are not part of the original design...
07/13/11 ASML announces 2011 second quarter results
Key Higlights:
*Q2 2011 net sales of EUR 1,529 million versus Q1 2011 net sales of EUR 1,452 million (Q2 2010 net sales of EUR 1,069 million).
*Q2 2011 net income of EUR 432 million, or 28.3 percent of net sales, versus a Q1 2011 net income of EUR 395 million or 27.2 percent of net sales (Q2 2010 net income of EUR 239 million or 22.4 percent of net sales).
*Q2 2011 net bookings excluding EUV is valued at EUR 840 million with 34 systems (29 new and 5 used systems), leading to a systems backlog excluding EUV valued at EUR 2,756 million as of June 26, 2011.
07/12/11 ASML enhances NXT:1950i
Enhancements meet challenging imaging and overlay requirements and provide a cost effective platform for 22nm
ASML today announced three new extensions for its popular TWINSCAN NXT platform that improve imaging, overlay and productivity. The extensions enable chipmakers to manufacture smaller, faster chips more cost-effectively. The first NXT:1950i system shipped in 2009 and today more than 80 systems are in use by chipmakers around the world manufacturing current state-of-the-art devices at resolutions of 45- to 32-nm.Manufacturing 22-nm devices will require much more accurate imaging and overlay performance. To meet that performance ASML has introduced FlexWave programmable wavefronts. Just as FlexRay customized illumination provides virtually unlimited source tuning within the illuminator, FlexWave allows programmable wavefronts within the lens...
04/13/11 ASML announces 2011 first quarter results
Strong first quarter confirms expectation for another record year
Highlights:
*Q1 2011 net sales of EUR 1,452 million versus Q4 2010 net sales of EUR 1,521 million (Q1 2010 net sales of EUR 742 million).
*Q1 2011 net income of EUR 395 million, or 27.2 percent of net sales, versus a Q4 2010 net income of EUR 407 million or 26.7 percent of net sales (Q1 2010 net income of EUR 107 million or 14.5 percent of net sales).
*Q1 2011 net bookings valued at EUR 845 million with 40 systems including 36 new and 4 used systems, leading to a systems backlog valued at EUR 3,330 million as of March 27, 2011.
01/19/11 ASML announces 2010 Q4 and full year results
Highlights:
* Net sales of € 1,521 million, 69 systems shipped valued at € 1,313 million, service revenue at € 208 million
* Gross margin of 45.0%
* Operating margin of 32.4%
* Shipped 28 immersion systems
* Net bookings are valued at € 2,315 million with 117 systems
12/09/10 ASML Increases Q4 2010 bookings guidance
ASML Holding sees stronger than expected demand for lithography equipment, coming from most semiconductor market segments; while DRAM lithography demand is weakening less than originally planned, NAND Flash memory investments for the high volume ramp of new technologies and Foundry/Logic commitments for new strategic fab projects are driving brisk lithography demand for 2011...
10/13/10 ASML announces 2010 Q3 results: bookings level confirms strong lithography demand for structural capacity
* Q3 2010 net sales of EUR 1,176 million versus Q2 2010 net sales of EUR 1,069 million (Q3 2009 net sales of EUR 555 million).
* Q3 2010 net income of EUR 269 million, or 22.8 percent of net sales, versus a Q2 2010 net income of EUR 239 million, or 22.4 percent of net sales (Q3 2009 net income of EUR 20 million or 3.6 percent of net sales).
* Q3 2010 net bookings valued at EUR 1,297 million, with 60 systems including 42 new and 18 used systems, leading to a systems backlog valued at EUR 2,693 million as of Sept 26, 2010.
09/14/10 ASML and Brion unveil software that will optimize EUV manufacturing of the most advanced chips
Next generation semiconductor production will be facilitated by a new product introduced today by Brion Technologies, a division of ASML. Brion's new Tachyon NXE provides accurate predictive modeling specifically for ASML Extreme Ultraviolet (EUV) scanners, the upcoming technology for the chip industry which will enable smaller, faster, cheaper and more energy-efficient semiconductors. The accurate EUV modeling in Tachyon NXE will reduce both the development time and cost to produce chips on EUV systems...
07/14/10 ASML announces 2010 second quarter results; sales set for new high amid increasing semiconductor fab spend
ASML today announces 2010 second quarter results. “Our second quarter sales came in at EUR 1.069 billion, confirming the continued strong demand in the semiconductor industry for our leading edge lithography systems,” said Eric Meurice, President and Chief Executive Officer of ASML. “Our NXT:1950i is now enabling volume production of the most advanced and cost-efficient semiconductor nodes, with close to 20 systems shipped and half a million silicon wafers already exposed"…
07/13/10 Chip makers adopt ASML's holistic lithography to continue Moore's law
ASML today at SEMICON West announces broad customer adoption of holistic lithography products which optimize semiconductor scanner performance and provide a faster start to chip production. 100% of ASML's leading-edge scanners are now sold with one or more holistic lithography components. Semiconductor manufacturers face increasingly smaller margins of error as they shrink chip features. Holistic lithography provides a way to shrink within these margins to continue Moore's Law...
07/09/10 EUV litho sources improving, says workshop (source: EE Times)
Sources for extreme ultraviolet lithography are not yet sufficiently bright to allow commercial wafer throughputs, but they are improving sufficiently for beta tools shipping in 2011, according to participants at a workshop held in Maui, Hawaii.
03/03/10 ASML Receives Intel’s Preferred Quality Supplier Award
ASML has been recognized as one of 16 suppliers to receive Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2009. ASML is recognized for their significant contributions, providing Intel with lithography process tools, deemed essential to Intel’s success. ...
02/22/10 TSMC to Take Delivery of an ASML EUV Lithography System for Research and Development on Future Technology Generations
ASML today announced that Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM) will take delivery of a TWINSCAN NXE:3100 extreme ultra-violet (EUV) lithography system. This tool represents one of six NXE:3100 EUV systems for ASML’s worldwide partners and customers. ...
02/22/10 ASML FlexRay Illuminators Successfully Enter Market as Chip Makers Seek Design Flexibility for Continued Shrink
ASML today announces its new FlexRay programmable illumination system is finding strong acceptance by providing chip makers with virtually unlimited illumination source tuning. Faster, more flexible source tuning is essential for customers making full use of ASML’s powerful source and mask optimization (SMO) software aimed at continued chip feature shrink, initially in R&D and later proliferation in production. ...
