08/24/11 A.L.S.I. announces sales & service partnership in Korea
A.L.S.I. today announces a partnership has been established with SMSemitech for the sales and service activities in the Korean market for the support to existing and new customers of ALSI’s multibeam laser dicing technology. Established in 2001, SMSemitech is a sales and service organisation active in different fields, but in particular for the semiconductor industry. SMSemitech will build a specific ALSI support team, to support the customers and potential customers of ALSI’s multibeam system. This partnership is ALSI’s latest step in providing global customer support, strategically located near a customer base.
04/21/10 Multi Beam Laser Dicing, The New Standard For Laser Grooving And Dicing Of Low K Wafers
ALSI has again set the standard with their patented multi-beam laser dicing technology for a new application. After successful introductions and market leader position for transistor/diodes, LED’s and RFIC, ALSI has released this time successfully the multi-beam technology for grooving and dicing of low-k wafers.The introduction of low-k dielectrics is needed in order to continue the downscaling of microelectronic devices (extending Moore’s law). The transistor density increase in integrated circuits introduces performance challenges such as charge build up and cross talk. The materials used for low-k dielectrics are typically porous materials with fragile structures, having relatively low mechanical strength.
