08/31/10 ASM International publishes Interim Financial Report for the six-month period ended June 30, 2010
ASM International today published its Interim Financial Report for the six-month period ended June 30, 2010. This report includes an Interim Management Board Report, a responsibility statement and Consolidated Interim Financial Statements prepared in accordance with IAS 34 (Interim Financial Reporting). The Interim Financial Report comprises regulated information within the meaning of the Dutch Financial Markets Supervision Act...
07/29/07 ASMi reports second quarter 2010 operating results [ASMi]
Commenting on the results, Chuck del Prado, President and Chief Executive Officer of ASM International, said, "ASMI's second quarter performance reflects strong growth in both our wafer processing and assembly and packaging operations. Our Front-end business returned to profitability, we reached the cost reduction targets as set out in our global restructuring program...
05/21/10 ASM International N.V. announces results of annual general meeting of shareholders
ASM International today announced the results of its Annual General Meeting of Shareholders held May 20, 2010 in Amsterdam, The Netherlands. In line with the ASMI Boards' recommendations as included in the Company's proxy statement, shareholders approved all resolutions as proposed to the Annual Meeting...
04/28/10 ASM International books repeat orders for plasma enhanced ALD Systems, broadening its ALD portfolio with new applications
ASM International N.V.today announced that it has received multiple repeat orders this year for its plasma enhanced atomic layer deposition (PEALD) systems from a leading memory customer in Asia for volume manufacturing at multiple fab lines. All systems will be used for dielectrics in double patterning applications for advanced lithography at the 3X technology node and below...
04/28/10 ASM International Q1 2010 operating results report sequential growth in both Front-end and Back-end operations
ASM International N.V. reports today its first quarter 2010 operating results in accordance with US GAAP: First quarter of 2010 net sales of EUR 219.1 million, up 8% from the fourth quarter of 2009 and up 146% from the first quarter of 2009…
04/27/10 ASM International N.V. nominates new CFO and new Supervisory Board Member
ASM International N.V. today announced the nominations of Peter van Bommel for appointment as CFO and as a member of its Management Board and Martin van Pernis for appointment to its Supervisory Board...
02/24/10 ASM International Extends Market Leadership for High-k ALD, Books two New Pulsar Orders for both R&D and Manufacturing Ramp
ASMi today announced two new Pulsar® orders from leading logic customers. One system was purchased by a new customer for the development of next generation advanced high-k metal gates, while the second is a repeat order from an existing customer planning to use Pulsar in its 32 nm high-k manufacturing ramp. Both tools include multiple Pulsar high-k reactors. ...
01/20/10 ASM Enables Power Devices with new PowerFill(TM) Epitaxial Technology
ASM International N.V. introduces its PowerFillTM epitaxial silicon (Epi Si) trench fill process today. The new process enables void free filling of deep trenches with doped, epitaxial silicon. PowerFill is an enabling process technology as it is about 3 times faster than competing processes, reducing manufacturing costs and creating an additional degree of freedom in power device design. ...
12/09/09 ASM International N.V. and Air Liquide Sign Agreement on Advanced High-K ALD Precursors
ASM International N.V.and the Air Liquide Group announce that their collaboration has led to the signature of a license and preferred supplier agreement for ALOHATM advanced precursors. Under the terms of the agreement, Air Liquide will have access to ASM's key processes and material intellectual property related to the deposition of advanced ultra-high-k insulator films such as Yttrium-doped Zirconia, STO and BST. ...
12/07/09 ASM International N.V. Features Innovative Atomic Layer Deposition Processes at Luncheon Seminar
ASM International N.V. announces that it will be hosting a technical luncheon seminar in Baltimore, Maryland, on Wednesday, December 9, 2009, the last day of the International Electron Devices Meeting (IEDM). The seminar will address important materials, equipment and process innovations that enable high-k and metal gates in volume manufacturing, including processes using Atomic Layer Deposition (ALD) and Plasma Enhanced ALD (PEALD). ...
VLSI interview of CTO Ivo Raaijmakers by Dan Hutcheson
Single Wafer Technologies
In a single wafer process, the wafer processing is performed one wafer at a time. The Epsilon, Eagle, Levitor, Stellar and Polygon are all performing single wafer technologies.
Batch Wafer Technologies
In batch wafer processing, the wafer processing is performed with more than one wafer at a time. The typical range is from 25 wafers (1 cassette) up to 200 wafers (8 cassettes) at a time. Vertical furnaces are examples of batch processes. ...
